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Proceedings Article

Contact pressure distribution of chemical mechanical polishing based on bionic polishing pad

[+] Author Affiliations
Jun Wang, Xue-Ling Xing, Yu-Shan Lu, Liao-Yuan Zhang

Shenyang Ligong Univ. (China)

Proc. SPIE 7997, Fourth International Seminar on Modern Cutting and Measurement Engineering, 79972U (May 26, 2011); doi:10.1117/12.883014
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From Conference Volume 7997

  • Fourth International Seminar on Modern Cutting and Measurement Engineering
  • Jiezhi Xin; Lianqing Zhu; Zhongyu Wang
  • Beijing, China | December 10, 2010

abstract

In order to improve the uniformity of the contact pressure distribution of chemical mechanical polishing, based on the Winkler foundation principle of mechanics and phyllotaxis theory of biology, a kind of stannum fixed abrasive pad with bionic surface texture has been designed, and the contact mechanism and ANSYS model have been established. By the calculating and analysis of contact pressure distribution on polishing wafer, the contact pressure distribution and the effects of the geometrical and physical parameters polishing pad on the contact pressure distributions have been obtained. The results show that the horizontal effect of the polishing pad is very small, the uniformity of contact pressure distribution can be improved, and there are the phyllotactic parameters which make the contact pressure distribution more uniformity.

© (2010) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Jun Wang ; Xue-Ling Xing ; Yu-Shan Lu and Liao-Yuan Zhang
"Contact pressure distribution of chemical mechanical polishing based on bionic polishing pad", Proc. SPIE 7997, Fourth International Seminar on Modern Cutting and Measurement Engineering, 79972U (May 26, 2011); doi:10.1117/12.883014; http://dx.doi.org/10.1117/12.883014


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