Paper
24 May 2004 Target noise in overlay metrology
Author Affiliations +
Abstract
We have developed a method for calculating the statistical effects of spatial noise on the overlay measurement extracted from a given overlay target. The method has been applied to two kinds of overlay targets on three process layers, and the new metric, Target Noise, has been shown to correlate well to the random component of Overlay Mark Fidelity. A significant difference in terms of robustness has been observed between AIM targets and conventional Frame-in-Frame targets. The results fit well into the spatial noise hierarchy presented in this paper.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joel L. Seligson, Mike E. Adel, Pavel Izikson, Vladimir Levinski, and Dan Yaffe "Target noise in overlay metrology", Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); https://doi.org/10.1117/12.534515
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CITATIONS
Cited by 5 scholarly publications and 6 patents.
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KEYWORDS
Overlay metrology

Aluminum

Reticles

Scanners

Back end of line

Metrology

Metals

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