Airborne contamination control for 157-nm lithography: influence of ammonia contamination

Hidefumi Matsui; Junichi Kitano; Kosuke Yoshihara; Etsurou Kawaguchi; Takamitsu Furukawa; Kentaro Matsunaga; Toshiro Itani; Kiyoshi Fujii

doi:10.1117/12.534975

14 May 2004 Airborne contamination control for 157-nm lithography: influence of ammonia contamination

Hidefumi Matsui, Junichi Kitano, Kosuke Yoshihara, Etsurou Kawaguchi, Takamitsu Furukawa, Kentaro Matsunaga, Toshiro Itani, Kiyoshi Fujii

Author Affiliations +

Proceedings Volume 5376, Advances in Resist Technology and Processing XXI; (2004) https://doi.org/10.1117/12.534975
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

The ammonia durability of the 157-nm lithography resists is still unclear due to the smaller target dimensions, thinner resist films, and variations in base polymer compared to those of 193-nm and 248-nm resists. It has not been determined what ammonia concentrations must be achieved in order to successfully process 157-nm resists. Until now, the ammonia durability of initial 157-nm resists during post exposure delay (PED) and during post coating delay (PCD) was compared to those of 193-nm and 248-nm resists. It was confirmed that all initial 157-nm resists had low ammonia durability. In this paper, the ammonia durability of newly developed 157-nm resists, that have improved transmittance and resolution, was evaluated during PED and PCD. Then, we found that the ammonia durability of these resists were not enough and that the ammonia concentration from exposure to development should be kept under 0.1 ppb. Thermal desorption spectroscopy results showed that resists with lower ammonia durability tended to have more amount of adsorbed ammonia than other resists. Furthermore, the ammonia durability of 157-nm resist couldn’t be improved to the level of that of 193- and 248-nm resist by the adjustment amount of resist additives. Due to the low ammonia durability, it will be necessary to control the ammonia concentration below 0.1 ppb in processing equipment used in 157-nm lithography.

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Hidefumi Matsui, Junichi Kitano, Kosuke Yoshihara, Etsurou Kawaguchi, Takamitsu Furukawa, Kentaro Matsunaga, Toshiro Itani, and Kiyoshi Fujii "Airborne contamination control for 157-nm lithography: influence of ammonia contamination", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); https://doi.org/10.1117/12.534975

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KEYWORDS

Contamination

Lithography

Coating

Polymers

Adsorption

Transmittance

Contamination control

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