High-density multimode photonic backplane

Min-Yi Shih; Christoph Erben; Thomas Gorczyca; Samhita Dasgupta; Ernest Balch; Glenn Claydon; Todd Tolliver; Renato Guida; William Kornrumpf; Matthew Nielsen; Eric Breitung

doi:10.1117/12.560093

8 October 2004 High-density multimode photonic backplane

Min-Yi Shih, Christoph Erben, Thomas Gorczyca, Samhita Dasgupta, Ernest Balch, Glenn Claydon, Todd Tolliver, Renato Guida, William Kornrumpf, Matthew Nielsen, Eric Breitung

Author Affiliations +

Proceedings Volume 5515, Nanoengineering: Fabrication, Properties, Optics, and Devices; (2004) https://doi.org/10.1117/12.560093
Event: Optical Science and Technology, the SPIE 49th Annual Meeting, 2004, Denver, Colorado, United States

Abstract

The development of a photonic backplane for high-speed and high-bandwidth communications is presented. This hybrid, multimode, multi-channel backplane structure contains both electrical and optical interconnects, suitable for next-generation high-speed servers with terabit backplane capacity. Removable and all-passively aligned high density interconnects on this backplane are achieved by polymer based optical waveguides with integrated micro-optics and VCSEL arrays on conventional printed circuit boards. The fabrication of this photonic backplane requires few additional steps outside a traditional board-manufacturing environment and is largely compatible with existing processes.

Citation Download Citation

Min-Yi Shih, Christoph Erben, Thomas Gorczyca, Samhita Dasgupta, Ernest Balch, Glenn Claydon, Todd Tolliver, Renato Guida, William Kornrumpf, Matthew Nielsen, and Eric Breitung "High-density multimode photonic backplane", Proc. SPIE 5515, Nanoengineering: Fabrication, Properties, Optics, and Devices, (8 October 2004); https://doi.org/10.1117/12.560093

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