Paper
18 October 2004 EUV microlithography: a challenge for optical metrology
Gunther Seitz, Stefan Schulte, Udo Dinger, Oliver Hocky, Bernhard Fellner, Markus Rupp
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Abstract
EUVL (extreme ultraviolet lithography), utilizing an actinic wavelength of about 13 nm , appears to be the most promising technology approach to reach the 30 nm node. Calling for diffraction limited imaging performance, EUV demand unprecedented requirements for figure metrology and fabrication technology. This paper gives an overview over problems rising from the interferometric measurement of aspheric EUV mirrors.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gunther Seitz, Stefan Schulte, Udo Dinger, Oliver Hocky, Bernhard Fellner, and Markus Rupp "EUV microlithography: a challenge for optical metrology", Proc. SPIE 5533, Advances in Mirror Technology for X-Ray, EUV Lithography, Laser, and Other Applications II, (18 October 2004); https://doi.org/10.1117/12.556317
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Cited by 5 scholarly publications.
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KEYWORDS
Interferometers

Aspheric lenses

Wavefronts

Mirrors

Error analysis

Extreme ultraviolet

Extreme ultraviolet lithography

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