Hybrid integration platform for planar lightwave subsystems

Louay Eldada

doi:10.1117/12.567609

20 December 2004 Hybrid integration platform for planar lightwave subsystems

Louay Eldada

Proceedings Volume 5577, Photonics North 2004: Optical Components and Devices; (2004) https://doi.org/10.1117/12.567609
Event: Photonics North, 2004, Ottawa, Ontario, Canada

Abstract

We report on a hybrid organic/inorganic platform that allows the integration of passive and active optical functions to form planar lightwave subsystems. The integration approaches include chip-to-chip attach, flip-chip mounting, and insertion of films in slots formed in optical waveguiding circuitry. The materials integrated include polymer, silica, silicon, silicon oxynitride, lithium niobate, indium phosphide, gallium arsenide, yttrium iron garnet, and neodymium iron boron. The functions enabled by the hybrid integration approaches span the range of building blocks needed in optical circuitry, while using the highest-performance material system for each function. We demonstrate a number of subsystems on a chip, including fully reconfigurable optical add/drop multiplexers and tunable optical transmitters.

Citation Download Citation

Louay Eldada "Hybrid integration platform for planar lightwave subsystems", Proc. SPIE 5577, Photonics North 2004: Optical Components and Devices, (20 December 2004); https://doi.org/10.1117/12.567609

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