Classifier combination for wafer segmentation

Pierrick T. Bourgeat; Fabrice Meriaudeau

doi:10.1117/12.592109

24 February 2005 Classifier combination for wafer segmentation

Pierrick T. Bourgeat, Fabrice Meriaudeau

Proceedings Volume 5679, Machine Vision Applications in Industrial Inspection XIII; (2005) https://doi.org/10.1117/12.592109
Event: Electronic Imaging 2005, 2005, San Jose, California, United States

Abstract

In the last decade, the accessibility of inexpensive and powerful computers has allowed true digital holography to be used for industrial inspection using microscopy. This technique allows capturing a complex image of a scene (i.e. containing magnitude and phase), and reconstructing the phase and magnitude information. Digital holograms give a new dimension to texture analysis since the topology information can be used as an additional way to extract features. This new technique can be used to extend previous work on image segmentation of patterned wafers for defect detection. This paper presents a combination of features obtained using Gabor filtering on different complex images. The combination enables to cope with the intensity variations occurring during the holography and provides final results which are independent from the selected training samples.

Citation Download Citation

Pierrick T. Bourgeat and Fabrice Meriaudeau "Classifier combination for wafer segmentation", Proc. SPIE 5679, Machine Vision Applications in Industrial Inspection XIII, (24 February 2005); https://doi.org/10.1117/12.592109

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