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Proceedings Article

Integrating DfM components into a cohesive design-to-silicon solution (Invited Paper)

[+] Author Affiliations
Lars Liebmann, Dan Maynard, Kevin McCullen, Nakgeuon Seong, Ed Buturla

IBM Systems and Technology Group (USA)

Mark Lavin, Jason Hibbeler

IBM Corp. (USA)

Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, 1 (May 13, 2005); doi:10.1117/12.604723
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From Conference Volume 5756

  • Design and Process Integration for Microelectronic Manufacturing III
  • Lars W. Liebmann
  • San Jose, CA | February 27, 2005

abstract

Two primary tracks of DfM, one originating from physical design characterization, the other from low-k1 lithography, are described. Examples of specific DfM efforts are given and potentially conflicting layout optimization goals are pointed out. The need for an integrated DfM solution than ties together currently parallel DfM efforts of increasing sophistication and layout impact is identified and a novel DfM-enabling design flow is introduced.

© (2005) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Lars Liebmann ; Dan Maynard ; Kevin McCullen ; Nakgeuon Seong ; Ed Buturla, et al.
"Integrating DfM components into a cohesive design-to-silicon solution (Invited Paper)", Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, 1 (May 13, 2005); doi:10.1117/12.604723; http://dx.doi.org/10.1117/12.604723


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