3D capacitive tactile sensor using DRIE micromachining

Chiehtang Chuang; Rongshun Chen

doi:10.1117/12.608621

1 July 2005 3D capacitive tactile sensor using DRIE micromachining

Chiehtang Chuang, Rongshun Chen

Proceedings Volume 5836, Smart Sensors, Actuators, and MEMS II; (2005) https://doi.org/10.1117/12.608621
Event: Microtechnologies for the New Millennium 2005, 2005, Sevilla, Spain

Abstract

This paper presents a three dimensional micro capacitive tactile sensor that can detect normal and shear forces which is fabricated using deep reactive ion etching (DRIE) bulk silicon micromachining. The tactile sensor consists of a force transmission plate, a symmetric suspension system, and comb electrodes. The sensing character is based on the changes of capacitance between coplanar sense electrodes. High sensitivity is achieved by using the high aspect ratio interdigital electrodes with narrow comb gaps and large overlap areas. The symmetric suspension mechanism of this sensor can easily solve the coupling problem of measurement and increase the stability of the structure. In this paper, the sensor structure is designed, the capacitance variation of the proposed device is theoretically analyzed, and the finite element analysis of mechanical behavior of the structures is performed.

Citation Download Citation

Chiehtang Chuang and Rongshun Chen "3D capacitive tactile sensor using DRIE micromachining", Proc. SPIE 5836, Smart Sensors, Actuators, and MEMS II, (1 July 2005); https://doi.org/10.1117/12.608621

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