Parallel interconnect components for optical modules utilizing flip-chip VCSEL on ultra-thin silicon-on-sapphire substrate

Serey Thai; Charles Kuznia; M. P. Divakar; Donald J. Albares; Mike Pendleton; Tri Le; Paul M. Bachta; Rick Hagan; Dick Pommer; Jim Cable; Ronald E. Reedy

doi:10.1117/12.469238

4 June 2002 Parallel interconnect components for optical modules utilizing flip-chip VCSEL on ultra-thin silicon-on-sapphire substrate

Serey Thai, Charles Kuznia, M. P. Divakar, Donald J. Albares, Mike Pendleton, Tri Le, Paul M. Bachta, Rick Hagan, Dick Pommer, Jim Cable, Ronald E. Reedy

Author Affiliations +

Proceedings Volume 4649, Vertical-Cavity Surface-Emitting Lasers VI; (2002) https://doi.org/10.1117/12.469238
Event: Symposium on Integrated Optoelectronic Devices, 2002, San Jose, California, United States

Abstract

We report on optical components for parallel transmit and receive module, operating at 850nm, designed for short haul optical multimode fiber networks. The component is realized by flip-chip bonding of arrayed optoelectronic devices, i.e., VCSEL and PIN detector array, onto ultra-thin silicon- on-sapphire (UTSi) substrate, which is optically transparent and electrically insulated. Flip-chipped assemblies provide several advantages over conventional wire bond techniques, such as extremely low interconnection parasitics that enable high data rates at low power. Using UTSi technology further improves performance by minimizing crosstalk through its insulating substrate while providing the means for a reliable, low cost optical assembly directly onto the substrate. In addition, applying UTSi technology to optical modules allows a higher degree of functional integration within the module. The insulating substrate provides excellent isolation between mixed signal circuitry, enabling the integration of high performance transmitters, receivers and other sensitive analog circuits with digital circuitry on the same substrate. Furthermore, the integration of VCSEL and photodetector array with UTSi circuits for parallel optical interconnects yields several packaging advantages, such as parallelism, scalability, compactness and simplicity.

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Serey Thai, Charles Kuznia, M. P. Divakar, Donald J. Albares, Mike Pendleton, Tri Le, Paul M. Bachta, Rick Hagan, Dick Pommer, Jim Cable, and Ronald E. Reedy "Parallel interconnect components for optical modules utilizing flip-chip VCSEL on ultra-thin silicon-on-sapphire substrate", Proc. SPIE 4649, Vertical-Cavity Surface-Emitting Lasers VI, (4 June 2002); https://doi.org/10.1117/12.469238

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