Paper
3 June 2002 Welding-induced alignment distortion in DIP LD packages: effect of laser welding sequence
Wenning Liu, Yaomin Lin, Frank G. Shi
Author Affiliations +
Abstract
In pigtailing of a single mode fiber to a semiconductor laser for optical communication applications, the tolerance for displacement of the fiber relative to the laser is extremely tight, a submicron movement can often lead to a significant misalignment and thus the reduction in the power coupled into the fiber. Among various fiber pigtailing assembly technologies, pulsed laser welding is the method with submicron accuracy and is most conducive to automation. However, the melting-solidification process during laser welding can often distort the pre-achieved fiber-optic alignment. This Welding-Induced-Alignment-Distortion (WIAD) is a serious concern and significantly affects the yield for single mode fiber pigtailing to a semiconductor laser. This work presents a method for predicting WIAD as a function of various processing, laser, tooling and materials parameters. More specifically, the degree of WIAD produced by the laser welding in a dual-in-line laser diode package is predicted for the first time. An optimal welding sequence is obtained for minimizing WIAD.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wenning Liu, Yaomin Lin, and Frank G. Shi "Welding-induced alignment distortion in DIP LD packages: effect of laser welding sequence", Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); https://doi.org/10.1117/12.469560
Lens.org Logo
CITATIONS
Cited by 9 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Laser welding

Semiconductor lasers

Laser processing

Finite element methods

Laser applications

Fiber coupled lasers

Structured optical fibers

RELATED CONTENT

Next generation diode lasers with enhanced brightness
Proceedings of SPIE (February 19 2018)
Contactless laser bending of silicon microstructures
Proceedings of SPIE (April 24 2003)
Laser Welding Of Cylinders
Proceedings of SPIE (August 05 1986)

Back to Top