Paper
27 December 2001 Effects of diamond cutting tool's rake angle and edge radius on the diamond turned surface quality
Qingliang Zhao, Shen Dong, Ying-Chun Liang, Yi Zhao
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Abstract
For the purpose of realizing the brittle material's turning in ductile mode on the basis of optimizing the diamond cutting tool's geometrical parameters, the Linear Elastic Fracture Mechanics and Finite Element Method are applied to stimulate the stress distribution and micro-cracks' propagation in the cutting region generated under different rake angles and edge radius. The cutting experiments on single crystal silicon surface are then conducted to verify the stimulation results, which show that the propagation of micro-cracks can be restrained from atomic-size cracks when utilizing the diamond cutting tools with -15 degree to -25 degree rake angles. As a result of increasing the critical depth of cut value of brittle-ductile transition, the goal of ductile-mode turning can be achieved. In addition, with a smaller cutting edge radius, the turning of brittle material in ductile-mode can be easily realized, resulting in good diamond turned surface quality.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Qingliang Zhao, Shen Dong, Ying-Chun Liang, and Yi Zhao "Effects of diamond cutting tool's rake angle and edge radius on the diamond turned surface quality", Proc. SPIE 4451, Optical Manufacturing and Testing IV, (27 December 2001); https://doi.org/10.1117/12.453647
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KEYWORDS
Finite element methods

Diamond machining

Silicon

Crystals

Diamond

Mechanics

Atomic force microscopy

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