Chemical mechanical planarization: an effective microfabrication and micromachining technology for MEMS

Juikun Lee; Ronald Myers; Tina Dear; Carl Gensler

doi:10.1117/12.478291

15 January 2003 Chemical mechanical planarization: an effective microfabrication and micromachining technology for MEMS

Juikun Lee, Ronald Myers, Tina Dear, Carl Gensler

Proceedings Volume 4979, Micromachining and Microfabrication Process Technology VIII; (2003) https://doi.org/10.1117/12.478291
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

Chemical mechanical planarization (CMP) is an integral process in the semiconductor industry that enables the fabrication of advanced integrated circuit (IC) components. It is the method of choice for obtaining both local and global planarization of IC thin films, including metals, such as copper, aluminum and tungsten, and dielectrics such as silicon dioxide. An emerging area for application of CMP is in Micro-Electro-Mechanical Systems (MEMS). Fabricated from a variety of materials, including polymers, metals and ceramics, MEMS devices present new opportunities and new challenges for CMP. This paper describes the planarization and fabrication requirements of MEMS CMP, from both a materials and a processing perspective, with a comparison to IC CMP. Examples using popular MEMS fabrication materials, such as standard and photosensitive polyimides, alumina and copper, will demonstrate the efffectiveness of CMP for microfabrication and micromachining applications. Additional results will illustrate the use of CMP as a means to selectively and controllably effect a high degree of planarization efficiency on a variety of microelectronics substrates. Finally, the role of CMP in meeting future MEMS/MOEMS-related applications will be addressed.

Citation Download Citation

Juikun Lee, Ronald Myers, Tina Dear, and Carl Gensler "Chemical mechanical planarization: an effective microfabrication and micromachining technology for MEMS", Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); https://doi.org/10.1117/12.478291

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