Telemetered sensors for dynamic activity and structural performance monitoring

Christopher P. Townsend; Michael J. Hamel; Steven W. Arms

doi:10.1117/12.436605

16 August 2001 Telemetered sensors for dynamic activity and structural performance monitoring

Christopher P. Townsend, Michael J. Hamel, Steven W. Arms

Proceedings Volume 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS; (2001) https://doi.org/10.1117/12.436605
Event: SPIE's 8th Annual International Symposium on Smart Structures and Materials, 2001, Newport Beach, CA, United States

Abstract

The development of improved structures requires knowledge of their dynamic behavior. Minimally intrusive wireless systems, capable of monitoring vibration and impact, are needed in order to provide this knowledge. Our objective was to design, build, and test a high speed data collection and wireless data communications system, including microsensors, and capable of being embedded or externally worn. Our previous transmitter designs were small and could be used to transmit multichannel digital data, but they were not capable of fast data transmission rates. The addition of a remotely triggered datalogger allowed us to overcome the limitations of our earlier designs. A bi-directional RF communications link was used to trigger a sample to be logged (from 30 meters), as well as to request data to be transmitted to the host PC for data acquisition/analysis. Sweep rates of 2000 Hz were successfully demonstrated from a triad of MEMs accelerometers. The remote datalogger and transceiver and accelerometer package measured 12 mm by 24 mm by 6 mm thick; these were mounted to the feet of thoroughbred horses to study their impact levels. These small, fast, wireless data recording systems can be used to monitor rotating/ vibrating machinery and civil/automotive/aerospace structures.

Citation Download Citation

Christopher P. Townsend, Michael J. Hamel, and Steven W. Arms "Telemetered sensors for dynamic activity and structural performance monitoring", Proc. SPIE 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS, (16 August 2001); https://doi.org/10.1117/12.436605

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