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Proceedings Article

Insertion of EUVL into high-volume manufacturing

[+] Author Affiliations
Peter J. Silverman

Intel Corp. (USA)

Proc. SPIE 4343, Emerging Lithographic Technologies V, 12 (August 20, 2001); doi:10.1117/12.436631
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From Conference Volume 4343

  • Emerging Lithographic Technologies V
  • Elizabeth A. Dobisz
  • Santa Clara, CA | February 25, 2001

abstract

EUV Lithography has become the leading and perhaps only, candidate for extension of semiconductor lithography into the sub-50nm realm. This paper reviews the requirements for high volume, semiconductor lithography and examines the capability of EUVL to meet those challenges. The current state of EUVL technology is reviewed and the remaining challenges for insertion of EUVL into manufacturing are discussed.

© (2001) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Peter J. Silverman
"Insertion of EUVL into high-volume manufacturing", Proc. SPIE 4343, Emerging Lithographic Technologies V, 12 (August 20, 2001); doi:10.1117/12.436631; http://dx.doi.org/10.1117/12.436631


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