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Proceedings Article

Haidinger interferometer for silicon wafer TTV measurement

[+] Author Affiliations
Robert E. Parks

Optical Perspectives Group and NIST (USA)

Lianzhen Shao

Tucson Optical Research Corp. (USA)

Angela D. Davies, Christopher J. Evans

National Institute of Standards and Technology (USA)

Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, 496 (August 22, 2001); doi:10.1117/12.436775
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From Conference Volume 4344

  • Metrology, Inspection, and Process Control for Microlithography XV
  • Neal T. Sullivan
  • Santa Clara, CA | February 25, 2001

abstract

We describe a novel, IR phase shifting Haidinger fringe interferometer for measuring the thickness, total thickness variation (TTV) and bow of silicon wafers. We show that by taking 3 interferograms of the wafer in different positions in the cavity it is possible to separate thickness, TTV and bow. We also show that bow has an effect on the measurement of TTV.

© (2001) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Robert E. Parks ; Lianzhen Shao ; Angela D. Davies and Christopher J. Evans
"Haidinger interferometer for silicon wafer TTV measurement", Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, 496 (August 22, 2001); doi:10.1117/12.436775; http://dx.doi.org/10.1117/12.436775


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