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Proceedings Article

Characteristic study of chip-on-film interconnection

[+] Author Affiliations
Shyh-Ming Chang

Industrial Technology Research Institute and National Tsing-Hua Univ. (Taiwan)

JwoHuei Jou

National Tsing-Hua Univ. (Taiwan)

Adam Hsieh, TaiHong Chen, HongYu Lin

Industrial Technology Research Institute (Taiwan)

ChingYun Chang, YungHao Wang, Chun M. Huang

Wintek Corp. (Taiwan)

Proc. SPIE 4079, Display Technologies III, 228 (June 30, 2000); doi:10.1117/12.389412
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From Conference Volume 4079

  • Display Technologies III
  • I-Wei Wu; Heiju Uchiike
  • Taipei, Taiwan | July 26, 2000


Chip-on-film is a new technology after tape-automated- bonding (TAB) and chip-on glass (COG) in the interconnection of liquid crystal module. The thickness of the film, which is more flexible than TAB, can be as thin as 44 micrometers . It has pre-test capability, while COG hasn't. It possesses great potential in many product fabrication applications. In this study, we used anisotropic conductive film as the adhesive to bind the desired IC chip and polyimide film.

© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Shyh-Ming Chang ; JwoHuei Jou ; Adam Hsieh ; TaiHong Chen ; ChingYun Chang, et al.
"Characteristic study of chip-on-film interconnection", Proc. SPIE 4079, Display Technologies III, 228 (June 30, 2000); doi:10.1117/12.389412; http://dx.doi.org/10.1117/12.389412

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