Characteristic study of chip-on-film interconnection

Shyh-Ming Chang; JwoHuei Jou; Adam Hsieh; TaiHong Chen; ChingYun Chang; YungHao Wang; HongYu Lin; Chun Ming Huang

doi:10.1117/12.389412

30 June 2000 Characteristic study of chip-on-film interconnection

Shyh-Ming Chang, JwoHuei Jou, Adam Hsieh, TaiHong Chen, ChingYun Chang, YungHao Wang, HongYu Lin, Chun Ming Huang

Proceedings Volume 4079, Display Technologies III; (2000) https://doi.org/10.1117/12.389412
Event: Photonics Taiwan, 2000, Taipei, Taiwan

Abstract

Chip-on-film is a new technology after tape-automated- bonding (TAB) and chip-on glass (COG) in the interconnection of liquid crystal module. The thickness of the film, which is more flexible than TAB, can be as thin as 44 micrometers . It has pre-test capability, while COG hasn't. It possesses great potential in many product fabrication applications. In this study, we used anisotropic conductive film as the adhesive to bind the desired IC chip and polyimide film.

Citation Download Citation

Shyh-Ming Chang, JwoHuei Jou, Adam Hsieh, TaiHong Chen, ChingYun Chang, YungHao Wang, HongYu Lin, and Chun Ming Huang "Characteristic study of chip-on-film interconnection", Proc. SPIE 4079, Display Technologies III, (30 June 2000); https://doi.org/10.1117/12.389412

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