Chip-on-film is a new technology after tape-automated- bonding (TAB) and chip-on glass (COG) in the interconnection of liquid crystal module. The thickness of the film, which is more flexible than TAB, can be as thin as 44 micrometers . It has pre-test capability, while COG hasn't. It possesses great potential in many product fabrication applications. In this study, we used anisotropic conductive film as the adhesive to bind the desired IC chip and polyimide film.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.