Thick photoresist imaging using a three-wavelength exposure stepper

Bradley Todd; Warren W. Flack; Sylvia White

doi:10.1117/12.361238

30 August 1999 Thick photoresist imaging using a three-wavelength exposure stepper

Bradley Todd, Warren W. Flack, Sylvia White

Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361238
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

Images formed in thick photosensitive materials are widely used as electroplating molds for micro-electromechanical (MEMS) part and other electronic applications such as bump bonding, thin film heads and multichip module manufacturing. The expansion of traditional microelectronic lithography into very thick photoresists present a technical challenge for stepper manufacturers that have traditionally attempted to optimize resolution and depth of focus for thin photoresist systems. Stepper optics and illumination needs to be re-optimized for the best performance in thick photosensitive materials.

Citation Download Citation

Bradley Todd, Warren W. Flack, and Sylvia White "Thick photoresist imaging using a three-wavelength exposure stepper", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); https://doi.org/10.1117/12.361238

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