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Proceedings Article

3D flash ladar at Raytheon

[+] Author Affiliations
Maurice J. Halmos, Michael D. Jack, James F. Asbrock, C. Anderson, Steven L. Bailey, George Chapman, E. Gordon, P. E. Herning, Murray H. Kalisher, Louis F. Klaras, Kim Kosai, V. Liquori, Mike Pines, Valerie Randall, Robin Reeder, Joseph P. Rosbeck, Sanghamitra Sen, Patrick A. Trotta, P. Wetzel

Raytheon Co. (USA)

Andrew T. Hunter, John E. Jensen, T. J. DeLyon

HRL Labs. LLC (USA)

Charlie W. Trussell

U.S. Army Night Vision and Electronic Sensors Directorate (USA)

James A. Hutchinson

U.S. Army Night Vision & Electronic Sensors Directorate (USA)

Raymond S. Balcerak

DARPA (USA)

Proc. SPIE 4377, Laser Radar Technology and Applications VI, 84 (September 19, 2001); doi:10.1117/12.440096
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From Conference Volume 4377

  • Laser Radar Technology and Applications VI
  • Gary W. Kamerman
  • Orlando, FL | April 16, 2001

abstract

Raytheon has recently been funded by DARPA to develop an FPA for single shot eyesafe ladar operation. The goal of the program is to develop new high speed imaging rays to rapidly acquire high resolution, 3D images of tactical targets at ranges as long as 7 to 10 kilometers. This would provide precision strike, target identification from rapidly moving platforms, such as air-to-ground seekers, which would enhance counter-counter measure performance and the ability to lock-on after launch. Also a goal is to demonstrate the acquisition of hidden, camouflaged and partially obscured targets. Raytheon's approach consists of using HgCdTe APD arrays which offer unique advantages for high performance eyesafe LADAR sensors. These include: eyesafe operation at room temperature, low excess noise, high gain to overcome thermal and preamp noise, Ghz bandwidth and high packing density. The detector array will be coupled with a Readout Integrated Circuit, that will capture all the information required for accurate range determination. The two components encompass a hybrid imaging array consisting of two IC circuit chips vertically integrated via an array of indium metal 'bumps'. The chip containing the PAD detector array and the silicon signal processing readout chip are independently optimized to provide the highest possible performance for each function.

© (2001) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Maurice J. Halmos ; Michael D. Jack ; James F. Asbrock ; C. Anderson ; Steven L. Bailey, et al.
"3D flash ladar at Raytheon", Proc. SPIE 4377, Laser Radar Technology and Applications VI, 84 (September 19, 2001); doi:10.1117/12.440096; http://dx.doi.org/10.1117/12.440096


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