Paper
11 November 1999 Mechanical behavior measurement of wood by ESPI method
Lijun Jiang, Anand Krishna Asundi, Kathrin Winkelmann
Author Affiliations +
Proceedings Volume 3897, Advanced Photonic Sensors and Applications; (1999) https://doi.org/10.1117/12.369340
Event: International Symposium on Photonics and Applications, 1999, Singapore, Singapore
Abstract
In this paper, a non-destructive testing technique, based on electronic speckle pattern interferometry, is presented to measure 4-point bending of wood. The mechanical behavior of the wood, such as Poisson Ratio can be obtained from the test result. To measure the out of plane displacement produced by 4-point bending, the wood specimen which is 33 X 3 X 3 mm, is secured in a special loading device. The loading device can produce 4- point bending symmetrically. The device with the specimen is put in a Michelson electronic speckle pattern interferometer assembly. Speckle pattern is produced on the natural 'rough' surface of the wood when illuminated by laser. A series of laser speckle interferograms are captured by a CCD camera and then sequentially subtracted to reveal deformation of the surface. Correlation fringes can be obtained while the load is applied. Both experimental results and theoretical analysis are presented.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lijun Jiang, Anand Krishna Asundi, and Kathrin Winkelmann "Mechanical behavior measurement of wood by ESPI method", Proc. SPIE 3897, Advanced Photonic Sensors and Applications, (11 November 1999); https://doi.org/10.1117/12.369340
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KEYWORDS
Speckle pattern

Speckle

Interferometry

CCD cameras

Nondestructive evaluation

Interferometers

Phase shift keying

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