Full Content is available to subscribers

Subscribe/Learn More  >
Proceedings Article

Nondestructive film thickness measurement using atomic force microscopy at ultrasonic frequencies

[+] Author Affiliations
Kenneth B. Crozier, Goeksenin G. Yaralioglu, Jesse D. Adams, Stephen C. Minne, Calvin F. Quate

Stanford Univ. (USA)

F. L. Degertekin

Georgia Institute of Technology (USA)

Proc. SPIE 4099, Optical Metrology Roadmap for the Semiconductor, Optical, and Data Storage Industries, 48 (November 2, 2000); doi:10.1117/12.405835
Text Size: A A A
From Conference Volume 4099

  • Optical Metrology Roadmap for the Semiconductor, Optical, and Data Storage Industries
  • Ghanim A. Al-Jumaily; Angela Duparre; Bhanwar Singh
  • San Diego, CA | July 30, 2000

abstract

We present a technique in which atomic force microscopy (AFM) at ultrasonic frequencies is used to measure the contact stiffness between an AFM tip and thin films on silicon substrates. In this method, the resonance frequencies of the cantilever flexural modes are used to determine the tip-sample contact stiffness. We present experimental results, showing that the contact stiffness is highly sensitive to the thickness of thin metal and polymer films. These results are compared with those from out theoretical model, which we call the Contact Stiffness Algorithm (CSA), that may be used to calculate the contact stiffness between an AFM tip and an arbitrarily layered sample. Unlike transmission electron microscopy (TEM) or scanning electron microscopy (SEM) on a cross-section of the sample, this film thickness measurement technique is non- destructive. It is also capable of high lateral spatial resolution, provided that a sharp AFM tip is used. We present images of a photoresist film on silicon with contrast resulting from the elastic properties of the sample.

© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Kenneth B. Crozier ; Goeksenin G. Yaralioglu ; F. L. Degertekin ; Jesse D. Adams ; Stephen C. Minne, et al.
"Nondestructive film thickness measurement using atomic force microscopy at ultrasonic frequencies", Proc. SPIE 4099, Optical Metrology Roadmap for the Semiconductor, Optical, and Data Storage Industries, 48 (November 2, 2000); doi:10.1117/12.405835; http://dx.doi.org/10.1117/12.405835


Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).

Figures

Tables

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging & repositioning the boxes below.

Related Book Chapters

Topic Collections

Advertisement


  • Don't have an account?
  • Subscribe to the SPIE Digital Library
  • Create a FREE account to sign up for Digital Library content alerts and gain access to institutional subscriptions remotely.
Access This Proceeding
Sign in or Create a personal account to Buy this proceeding ($15 for members, $18 for non-members).
Access This Proceeding
Sign in or Create a personal account to Buy this article ($15 for members, $18 for non-members).
Access This Chapter

Access to SPIE eBooks is limited to subscribing institutions and is not available as part of a personal subscription. Print or electronic versions of individual SPIE books may be purchased via SPIE.org.