Use of polymer waveguides for optical interconnection in high-speed communication and signal processing systems

Lucie Robitaille; Claire L. Callender; Julian P. Noad; Francois L. Gouin; Carlos Almeida

doi:10.1117/12.271107

4 April 1997 Use of polymer waveguides for optical interconnection in high-speed communication and signal processing systems

Lucie Robitaille, Claire L. Callender, Julian P. Noad, Francois L. Gouin, Carlos Almeida

Author Affiliations +

Proceedings Volume 3005, Optoelectronic Interconnects and Packaging IV; (1997) https://doi.org/10.1117/12.271107
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

GaAs optoelectronic integrated circuits are having an increasing impact on the development of lightwave communication systems and very high sped digital and analog signal processors. However, cost-effective integration of complex electronic and optoelectronic circuits used in high speed networks or backplane interconnects still presents a significant technological challenge and substantial efforts are being devoted to the development of practical, low-loss integration processes. Photodetector/waveguide integration is a key aspect of the successful packaging of optoelectronic devices. In this work, metal-semiconductor- metal (MSM) photodetectors were integrated with polyimide ridge waveguides, and the processing parameters were varied for optimum performance. The absolute responsivities of the integrated MSM/polyimide waveguide structures were typically 0.5 A/W, and 3 dB bandwidths of 4-6 GHz were measured. Series of 1 X 2 and 1 X 4 photodetector arrays were interconnected, demonstrating a uniform division of the optical signal between the detectors. Results indicate that these arrays offer the potential to fabricate optoelectronic switches that can be used in a variety of high speed and broadband communication systems.

Citation Download Citation

Lucie Robitaille, Claire L. Callender, Julian P. Noad, Francois L. Gouin, and Carlos Almeida "Use of polymer waveguides for optical interconnection in high-speed communication and signal processing systems", Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); https://doi.org/10.1117/12.271107

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available