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Proceedings Article

Single-crystal micromachining using multiple fusion-bonded layers

[+] Author Affiliations
Alan Brown

BCO Technologies (NI) Ltd. (United Kingdom)

Garry O'Neill

BCO Technologies (NI) Ltd. (Ireland)

Scott C. Blackstone

BCO America (USA)

Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, 406 (August 25, 2000); doi:10.1117/12.396460
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From Conference Volume 4174

  • Micromachining and Microfabrication Process Technology VI
  • Jean Michel Karam; John A. Yasaitis
  • Santa Clara, CA | September 18, 2000

abstract

Multi-layer structures have been fabricated using Fusion bonding. The paper shows void free layers of between 2 and 100 microns that have been bonded to form multi-layer structures. Silicon layers have been bonded both with and without interfacial oxide layers.

© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Alan Brown ; Garry O'Neill and Scott C. Blackstone
"Single-crystal micromachining using multiple fusion-bonded layers", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, 406 (August 25, 2000); doi:10.1117/12.396460; http://dx.doi.org/10.1117/12.396460


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