The potential and limits of micromoulding technology for the wafer scale hybrid integration of micro-optic elements on top of arbitrary substrates like glass, Silicon, III/V-semiconductors by a process which is performed in a modified contact mask aligner. The elements are characterised by high precision and stability, temperature stable and precise pitch, index, homogeneity, uniformity across the wafer, and they fulfill additional requirements for a practical application (AR-coating, separation in a dicing saw). Additionally, the technology for a two- sided replication of elements has been developed. The precision of lens arrays fabricated by reflow and UV-moulding is investigated, and the high performance of these arrays in the collimation of fiber arrays is shown. Steps toward a wafer scale integration of lens arrays with vertical cavity surface emitting lasers (VCSELs) by locally selective replication are demonstrated.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.