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Proceedings Article

Mask fabrication by nanoimprint lithography using antisticking layers

[+] Author Affiliations
Hubert Schulz, Frank Osenberg, J. Engemann, Hella-Christin Scheer

Univ. Wuppertal (Germany)

Proc. SPIE 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 244 (February 3, 2000); doi:10.1117/12.377114
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From Conference Volume 3996

  • 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents
  • Munich, Germany | November 15, 1999

abstract

We have studied anti-sticking layers for nanoimprint lithography using different types of polymers, thermoplastic and thermosetting ones. Typically thermosetting polymers have higher mask selectivity in a fluorocarbon dry etch process than the thermoplastic polymers, but replication into these materials is much more complicated. We observe a high tendency for the polymer to adhere to the stamp. To minimize the sticking problem a fluorocarbon coating of the stamp was tested. It was deposited in a radio frequency plasma reactor with C4F8 as a feed gas. The thickness of the coating was several nm. It was characterized by contact angle measurement, XPS and FTIR analysis. Such coatings could successfully reduce sticking effects during an imprint process.

© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Hubert Schulz ; Frank Osenberg ; J. Engemann and Hella-Christin Scheer
"Mask fabrication by nanoimprint lithography using antisticking layers", Proc. SPIE 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 244 (February 3, 2000); doi:10.1117/12.377114; http://dx.doi.org/10.1117/12.377114


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