Polymers for 157-nm photoresist applications: a progress report

Kyle Patterson; Mikio Yamachika; Raymond Jui-Pu Hung; Colin J. Brodsky; Shintaro Yamada; Mark H. Somervell; Brian Osborn; Daniel S. Hall; Gordana Dukovic; Jeff D. Byers; Will Conley; C. Grant Willson

doi:10.1117/12.388320

23 June 2000 Polymers for 157-nm photoresist applications: a progress report

Kyle Patterson, Mikio Yamachika, Raymond Jui-Pu Hung, Colin J. Brodsky, Shintaro Yamada, Mark H. Somervell, Brian Osborn, Daniel S. Hall, Gordana Dukovic, Jeff D. Byers, Will Conley, C. Grant Willson

Author Affiliations +

Proceedings Volume 3999, Advances in Resist Technology and Processing XVII; (2000) https://doi.org/10.1117/12.388320
Event: Microlithography 2000, 2000, Santa Clara, CA, United States

Abstract

Finding materials that offer the all of the characteristics required of photoresist matrix resin polymers while trying to maintain a high level of transparency at 157 nm is a daunting challenge. To simplify this task, we have broken the design of these polymers down into subunits, each of which is responsible for a required function in the final material. In addition, we have begun collecting gas-phase VUV spectra of these potential subunits to measure their individual absorbance contributions. Progress on developing materials for each of these subunits are presented along with plans for future studies.

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Kyle Patterson, Mikio Yamachika, Raymond Jui-Pu Hung, Colin J. Brodsky, Shintaro Yamada, Mark H. Somervell, Brian Osborn, Daniel S. Hall, Gordana Dukovic, Jeff D. Byers, Will Conley, and C. Grant Willson "Polymers for 157-nm photoresist applications: a progress report", Proc. SPIE 3999, Advances in Resist Technology and Processing XVII, (23 June 2000); https://doi.org/10.1117/12.388320

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