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Proceedings Article

Pad polishing for rapid production of large flats

[+] Author Affiliations
Ralph R. Berggren, Rodney A. Schmell

Los Alamos National Lab. (USA)

Proc. SPIE 3134, Optical Manufacturing and Testing II, 252 (November 1, 1997); doi:10.1117/12.295131
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From Conference Volume 3134

  • Optical Manufacturing and Testing II
  • H. Philip Stahl
  • San Diego, CA, United States | July 27, 1997

abstract

Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. Recent work has shown success on 350 mm square parts; current work involves scaling the process to 1.4 meter diameter. For the 350 mm square piece of BK7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing.

© (1997) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Topics

Polishing
Citation

Ralph R. Berggren and Rodney A. Schmell
"Pad polishing for rapid production of large flats", Proc. SPIE 3134, Optical Manufacturing and Testing II, 252 (November 1, 1997); doi:10.1117/12.295131; http://dx.doi.org/10.1117/12.295131


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