Microsystem packaging in 3D

Gerard Kelly; John C. Alderman; C. Lyden; James Barrett; Anthony Morrissey

doi:10.1117/12.284509

5 September 1997 Microsystem packaging in 3D

Gerard Kelly, John C. Alderman, C. Lyden, James Barrett, Anthony Morrissey

Proceedings Volume 3224, Micromachined Devices and Components III; (1997) https://doi.org/10.1117/12.284509
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States

Abstract

Packaging influences the reliability and performance of microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package is presented. Finite element techniques are used to analyze the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.

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Gerard Kelly, John C. Alderman, C. Lyden, James Barrett, and Anthony Morrissey "Microsystem packaging in 3D", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); https://doi.org/10.1117/12.284509

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KEYWORDS

Packaging

Microsystems

Reliability

Silicon

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