Paper
2 September 1997 Analysis and enhancement of bond strength of acrylic sheets to metallic substrates for use in LIGA-type processing
Author Affiliations +
Proceedings Volume 3225, Microlithography and Metrology in Micromachining III; (1997) https://doi.org/10.1117/12.284544
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
Abstract
In thick photoresist applications, commercially available acrylic sheets are bonded to a substrate as an alternative to the casting and in-situ polymerization of PMMA. The factors affecting the adhesion of a thick acrylic sheet to different substrates have been studied. In case of copper and titanium substrates and bond-strength can be improved by roughening the surface through chemical oxidation which then provides a mechanical interlocking between the resist and substrate surfaces. Annealing of PMMA sheet before gluing and use of adhesion promoter such as organosilane further improves the bond strength at the resist-substrate interface. The resist adhesion to various substrates is evaluated by measuring the debonded length of the acrylic sheet during a mechanical cleaving test.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Supipta S. Das, Harish M. Manohara, and Chantal G. Khan Malek "Analysis and enhancement of bond strength of acrylic sheets to metallic substrates for use in LIGA-type processing", Proc. SPIE 3225, Microlithography and Metrology in Micromachining III, (2 September 1997); https://doi.org/10.1117/12.284544
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Cited by 2 scholarly publications.
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KEYWORDS
Polymethylmethacrylate

Analytical research

Annealing

Copper

Interfaces

Oxidation

Photoresist materials

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