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Proceedings Article

Desktop manufacturing using diode lasers

[+] Author Affiliations
Chandrasekhar Roychoudhuri

Univ. of Connecticut (USA)

Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, 162 (June 3, 1998); doi:10.1117/12.309507
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From Conference Volume 3274

  • Laser Applications in Microelectronic and Optoelectronic Manufacturing III
  • Jan J. Dubowski; Peter E. Dyer
  • San Jose, CA | January 24, 1998

abstract

Semiconductor laser diodes, while not yet ready to replace YAG and CO2 lasers from heavy duty machining, are already capable of carrying out a number of manufacturing jobs that require a power density of 100 kw/cm2 or less, and CW power of 100 Watt or less. We present results of cutting cellulose materials, marking plastics, soldering electronic circuit boards, surface (transformation) hardening, chemical vapor phase deposition (by gas breakdown) using fiber coupled CW lasers at 810 nm (60 Watts) and 980 nm (25 Watts). We also present the results of sintering metal powders under different conditions to improve density and hardness, demonstrating that diodes can do an excellent job in solid free-form development (or rapid prototyping).

© (1998) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Citation

Chandrasekhar Roychoudhuri
"Desktop manufacturing using diode lasers", Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, 162 (June 3, 1998); doi:10.1117/12.309507; http://dx.doi.org/10.1117/12.309507


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