Determining photoresist coat sensitivities of 300-mm wafers

Robert M. Crowell

doi:10.1117/12.309595

5 June 1998 Determining photoresist coat sensitivities of 300-mm wafers

Robert M. Crowell

Proceedings Volume 3331, Emerging Lithographic Technologies II; (1998) https://doi.org/10.1117/12.309595
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

This paper presents preliminary data on 300 nm wafer coatings by comparing photoresist coats on 150 nm, 200 mm and 300 mm wafers. Conventional methods of applying photoresist have ben prove effective on wafers with diameters up to 200 nm. How well 150 mm and 200 mm coating processes apply to 300 mm substrates is the focus of this paper. Spin speed versus photoresists thickness curves will be reviewed for all three wafer sizes.Additionally, two major coating uniformity factors, photoresist and cool plate temperature, will be studied for 200 mm and 300 mm wafers.

Citation Download Citation

Robert M. Crowell "Determining photoresist coat sensitivities of 300-mm wafers", Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); https://doi.org/10.1117/12.309595

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