Paper
1 May 1994 Holographic interferometry applied to the characterization and analysis of the dynamic and modal behavior of complex circuit board structures
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Proceedings Volume 2176, Practical Holography VIII; (1994) https://doi.org/10.1117/12.172641
Event: IS&T/SPIE 1994 International Symposium on Electronic Imaging: Science and Technology, 1994, San Jose, CA, United States
Abstract
Holographic Interferometry has been successfully employed to characterize and test the behavior of diverse types of structures under stress. Such applications of holographic technique have proven to be among the most effective methods of modal and dynamic analysis available. The technology is non-destructive, real-time, and definitive in allowing the identification of vibrational modes, displacements, and motion geometry. Structures can be analyzed with very low amplitude excitation and the resultant data can be used to adjust the accuracy of mathematically derived structural models. Holographic methods have offered a powerful tool to aid in the primary engineering and development of complex circuit board assemblies which are used in highly mobile platforms. Avionic, undersea, and even automotive systems involve applications where the environment presents large vibrations and stresses which can affect operation and structural stability. These are ideal requisites for analysis using advanced time-average holographic methods in the initial engineering of such advanced systems.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Howard Fein "Holographic interferometry applied to the characterization and analysis of the dynamic and modal behavior of complex circuit board structures", Proc. SPIE 2176, Practical Holography VIII, (1 May 1994); https://doi.org/10.1117/12.172641
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Cited by 9 scholarly publications.
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KEYWORDS
Holography

Holograms

Holographic interferometry

Fringe analysis

Nondestructive evaluation

Acoustics

Data modeling

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