Multilevel microstructure fabrication using single-step 3D photolithography and single-step electroplating

Jun-Bo Yoon; Jae-Duk Lee; Chul-Hi Han; Euisik Yoon; Choong-Ki Kim

doi:10.1117/12.324080

1 September 1998 Multilevel microstructure fabrication using single-step 3D photolithography and single-step electroplating

Jun-Bo Yoon, Jae-Duk Lee, Chul-Hi Han, Euisik Yoon, Choong-Ki Kim

Author Affiliations +

Proceedings Volume 3512, Materials and Device Characterization in Micromachining; (1998) https://doi.org/10.1117/12.324080
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States

Abstract

We developed a useful method to obtain multilevel microstructures simply by single-step 3D photolithography followed by single-step electroplating. By varying UV exposure depth with multiple photomasks in a single-coated conventional thick photoresist, we form multilevel photoresist molds in a single lithography step. After the 3D mold patterning, metal electroplating is performed on it until 3D metallic microstructures are obtained. The critical issue in this process, the exposure depth control, was carefully examined by observing the exposure time versus development characteristic of the resist, in the film thickness range of 40 to 90 micrometer. We proposed a simple method to reproducibly obtain the resist thickness of each level as designed. Using the unique overplating feature in electroplating process, we demonstrated two utmost practical examples: a unified Orifice Plate Assembly (OPA), which has orifice, channel, and reservoirs in a single body, for high-resolution inkjet printhead, and an electroplated Solenoid-type Integrated Inductor (SI²). Both were fabricated using a single-coated 80 micrometer-thick photoresist with only two photomasks, and have many advantages in productivity and performance. This method does not stack planar layer vertically to make 3D microstructures as in the conventional ways, therefore, is a simple, low-cost, and high-yield process. And also, it is IC compatible due to its low process temperature and monolithic process.

Citation Download Citation

Jun-Bo Yoon, Jae-Duk Lee, Chul-Hi Han, Euisik Yoon, and Choong-Ki Kim "Multilevel microstructure fabrication using single-step 3D photolithography and single-step electroplating", Proc. SPIE 3512, Materials and Device Characterization in Micromachining, (1 September 1998); https://doi.org/10.1117/12.324080

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available