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Proceedings Article

Fused silica for 157-nm transmittance

[+] Author Affiliations
Charlene M. Smith, Lisa A. Moore

Corning Inc. (USA)

Proc. SPIE 3676, Emerging Lithographic Technologies III, 834 (June 25, 1999); doi:10.1117/12.351163
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From Conference Volume 3676

  • Emerging Lithographic Technologies III
  • Yuli Vladimirsky
  • Santa Clara, CA | March 14, 1999


The use of silica glass for the photomask material in 157-nm lithography tools is proposed. While fused silica enjoys widespread application for 248 and 193-nm optics, its use for 157-nm applications has been largely discounted, in part because of low transmittance at this wavelength. It is demonstrated here that silica glass can be made to have high transmittance at 157-nm. This is accomplished by minimizing the OH content of the glass. It is also noted that the thermal and mechanical properties of so-called dry silica are very close to higher OH silicas that are commonly used for lithography applications.

© (1999) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Charlene M. Smith and Lisa A. Moore
"Fused silica for 157-nm transmittance", Proc. SPIE 3676, Emerging Lithographic Technologies III, 834 (June 25, 1999); doi:10.1117/12.351163; http://dx.doi.org/10.1117/12.351163

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