Fabrication of thin film resistors and silicon microstructures using a frequency-doubled Nd:YAG laser

Alexander Wogersien; Stefan Dauer; Stephanus Buettgenbach

doi:10.1117/12.341182

10 March 1999 Fabrication of thin film resistors and silicon microstructures using a frequency-doubled Nd:YAG laser

Alexander Wogersien, Stefan Dauer, Stephanus Buettgenbach

Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341182
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France

Abstract

A laser-assisted technology for the fabrication of micro electro mechanical system has been developed. This method allows micromachining of bulk silicon wafers and silicon membranes by using a Q-switched Nd:YAG-laser with optional frequency doubling. Moreover, thin gold film resistors can be patterned on passivated silicon and glass substrates. Because direct laser processing is a highly flexible and timesaving method it is well studied for rapid prototyping and small volume production. Combining laser micromachining with conventional photolithographic techniques new designs of microsensors and actuators can be achieved.

Citation Download Citation

Alexander Wogersien, Stefan Dauer, and Stephanus Buettgenbach "Fabrication of thin film resistors and silicon microstructures using a frequency-doubled Nd:YAG laser", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); https://doi.org/10.1117/12.341182

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