High-speed aqueous-developing negative resist based on triflic-acid-catalyzed epoxy polymerization

Robert D. Allen; Will Conley; Jeffrey D. Gelorme

doi:10.1117/12.59745

1 June 1992 High-speed aqueous-developing negative resist based on triflic-acid-catalyzed epoxy polymerization

Robert D. Allen, Will Conley, Jeffrey D. Gelorme

Proceedings Volume 1672, Advances in Resist Technology and Processing IX; (1992) https://doi.org/10.1117/12.59745
Event: Microlithography '92, 1992, San Jose, CA, United States

Abstract

The need for higher resolution is a continuing driving force in the development of new lithographic materials. In this paper we discuss a new high speed, high resolution negative photoresist based on acid catalyzed epoxy polymerization. These materials are copolymers of two monomers that each provide a separate function in the photoresist. This combination provides a unique new material with aqueous processability in metal ion-free developers and high sensitivity to photogenerated triflic acid. Imaging characteristics in electron beam and i- line exposure systems are discussed.

Citation Download Citation

Robert D. Allen, Will Conley, and Jeffrey D. Gelorme "High-speed aqueous-developing negative resist based on triflic-acid-catalyzed epoxy polymerization", Proc. SPIE 1672, Advances in Resist Technology and Processing IX, (1 June 1992); https://doi.org/10.1117/12.59745

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