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18 June 2013 Design of 90×8 ROIC with pixel level digital TDI implementation for scanning type LWIR FPAs
Omer Ceylan, Huseyin Kayahan, Melik Yazici, Yasar Gurbuz
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Proceedings Volume 8704, Infrared Technology and Applications XXXIX; 870432 (2013) https://doi.org/10.1117/12.2018554
Event: SPIE Defense, Security, and Sensing, 2013, Baltimore, Maryland, United States
Abstract
Design of a 90×8 CMOS readout integrated circuit (ROIC) based on pixel level digital time delay integration (TDI) for scanning type LWIR focal plane arrays (FPAs) is presented. TDI is implemented on 8 pixels which improves the SNR of the system with a factor of √8. Oversampling rate of 3 improves the spatial resolution of the system. TDI operation is realized with a novel under-pixel analog-to-digital converter, which improves the noise performance of ROIC with a lower quantization noise. Since analog signal is converted to digital domain in-pixel, non-uniformities and inaccuracies due to analog signal routing over large chip area is eliminated. Contributions of each pixel for proper TDI operation are added in summation counters, no op-amps are used for summation, hence power consumption of ROIC is lower than its analog counterparts. Due to lack of multiple capacitors or summation amplifiers, ROIC occupies smaller chip area compared to its analog counterparts. ROIC is also superior to its digital counterparts due to novel digital TDI implementation in terms of power consumption, noise and chip area. ROIC supports bi-directional scan, multiple gain settings, bypass operation, automatic gain adjustment, pixel select/deselect, and is programmable through serial or parallel interface. Input referred noise of ROIC is less than 750 rms electrons, while power consumption is less than 20mW. ROIC is designed to perform both in room and cryogenic temperatures.
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Omer Ceylan, Huseyin Kayahan, Melik Yazici, and Yasar Gurbuz "Design of 90×8 ROIC with pixel level digital TDI implementation for scanning type LWIR FPAs", Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 870432 (18 June 2013); https://doi.org/10.1117/12.2018554
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KEYWORDS
Readout integrated circuits
Analog electronics
Capacitance
Digital electronics
Sensors
Signal to noise ratio
Multiplexers
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