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Alireza Sheikholeslami
at Technische Univ Wien
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Publications (1)
Proceedings Article | 21 April 2003 Paper
Simulation of void formation in interconnect lines
Alireza Sheikholeslami, Clemens Heitzinger, Helmut Puchner, Fuad Badrieh, Siegfried Selberherr
Proceedings Volume 5117, (2003) https://doi.org/10.1117/12.498783
KEYWORDS: Particles, Semiconducting wafers, Computer simulations, Deposition processes, Etching, Capacitance, Metals, Silicon, Chemical elements, Visibility
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