Dr. Didem Ozevin Profile

Dr. Didem Ozevin

Professor at Univ of Illinois at Chicago

SPIE Involvement:

Conference Program Committee | Author

Publications (38)

Proceedings Article | 18 April 2023 Paper

Adapting 1-D phononic crystals to contact nonlinear ultrasonics for enhancing damage detection in concrete

Tonghao Zhang, Chenxi Xu, Didem Ozevin

Proceedings Volume 12487, 1248709 (2023) https://doi.org/10.1117/12.2657750

KEYWORDS: Ultrasonics, Crystals, Lenses, Foam, Aluminum, Second harmonic generation, Wave propagation, Transmitters, Signal attenuation, Sensors

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Proceedings Article | 18 April 2023 Presentation + Paper

The efficiency of arrival time picking methods for acoustic emission source localization in structures with simultaneous damage mechanisms

Tonghao Zhang, Sena Tayfur, Didem Ozevin

Proceedings Volume 12487, 124870N (2023) https://doi.org/10.1117/12.2658577

KEYWORDS: Wavelets, Source localization, Sensors, Signal detection, Interference (communication), Signal to noise ratio, Acoustic emission, Detector arrays, Wave propagation, Data acquisition

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Proceedings Article | 18 April 2022 Presentation + Paper

Lamb wave focusing by gradient-index phononic crystal lens in layered composites

Chenxi Xu, Gorkem Okudan, Hrishikesh Danawe, Didem Ozevin, Serife Tol

Proceedings Volume 12047, 120470J (2022) https://doi.org/10.1117/12.2612906

KEYWORDS: Composites, Wave propagation, Dispersion, Crystals, Refractive index, Wave plates, Waveguides, Ultrasonics, Lens design, Phase velocity

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Proceedings Article | 18 April 2022 Presentation + Paper

The detection of fatigue crack in thick steel with phase array ultrasonics

Tanja Rakovic, Didem Ozevin

Proceedings Volume 12047, 1204715 (2022) https://doi.org/10.1117/12.2612929

KEYWORDS: Sensors, Ultrasonics, Waveguides, Distributed interactive simulations, Transmitters, Receivers, Cameras, Optical microscopes, Inspection, MATLAB

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Proceedings Article | 22 March 2021 Presentation + Paper

Simultaneous amplification of guided wave modes in polymer pipes via a structurally embedded gradient index lens

Hrishikesh Danawe, Ziqi Wang, Gorkem Okudan, Didem Ozevin, Serife Tol

Proceedings Volume 11591, 115910W (2021) https://doi.org/10.1117/12.2583158

KEYWORDS: GRIN lenses, Polymers, Waveguides, Ultrasonics, Signal attenuation, Refractive index, Lens design, Sensors, Inspection, Damage detection

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Proceedings Article | 22 March 2021 Presentation + Paper

Manipulating the torsional mode in pipe-like structures with mechanical lens for extended propagation distance

Gorkem Okudan, Hrishikesh Danawe, Serife Tol, Didem Ozevin

Proceedings Volume 11592, 1159213 (2021) https://doi.org/10.1117/12.2583303

KEYWORDS: Wave propagation, Metamaterials, Sensors, Lens design, GRIN lenses, Numerical simulations, Gradient-index optics, Fourier transforms, Computer simulations

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Proceedings Article | 19 May 2020 Presentation + Paper

Reciprocal amplification of wave front for planar or point sources using a metamaterial lens to increase the inspection distance of pipelines

Gorkem Okudan, Hrishikesh Danawe, Lu Zhang, Serife Tol, Didem Ozevin

Proceedings Volume 11380, 113800V (2020) https://doi.org/10.1117/12.2557404

KEYWORDS: GRIN lenses, Signal attenuation, Ultrasonics, Metamaterials, Inspection, Wave propagation, Lens design, Acoustics, Sensors, Nondestructive evaluation

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Proceedings Article | 18 May 2020 Presentation + Paper

Seismic energy dissipation of periodic assembly tensegrity system

Hongyu Li, Yue Wu, Lu Zhang, Didem Ozevin

Proceedings Volume 11379, 113790N (2020) https://doi.org/10.1117/12.2557075

KEYWORDS: Prisms, Bridges, Metamaterials, Civil engineering, Structural design, Shape memory alloys, Wave propagation, Directed self assembly, Resistance, Domes

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Proceedings Article | 22 April 2020 Presentation + Paper

Metamaterial-based amplification of multi-mode ultrasonic guided waves toward improved damage detection in pipelines (SPIE Best Student Paper Finalist)

H. Danawe, G. Okudan, D. Ozevin, S. Tol

Proceedings Volume 11376, 113761N (2020) https://doi.org/10.1117/12.2559785

KEYWORDS: GRIN lenses, Ultrasonics, Waveguides, Lens design, Refractive index, Inspection, Sensors, Dispersion, Damage detection

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Proceedings Article | 1 April 2019 Presentation + Paper

Optimized spatial placement of structural bolts in connections for effective ultrasonic inspection

Gorkem Okudan, Lu Zhang, Didem Ozevin

Proceedings Volume 10971, 1097104 (2019) https://doi.org/10.1117/12.2515360

KEYWORDS: Ultrasonics, Inspection, Corrosion, Receivers, Wave plates, Reflection, Signal attenuation, Process modeling, Scattering, Interfaces

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Proceedings Article | 1 April 2019 Presentation + Paper

The identification of accurate and computationally efficient arrival time pick-up method for acoustic tomography

L. Zhang, J. Dong, V. Godinez-Azcuaga, Obdulia Ley, E. Lowenhar, H. Saboonchi, D. Ozevin

Proceedings Volume 10971, 1097114 (2019) https://doi.org/10.1117/12.2515403

KEYWORDS: Sensors, Tomography, Signal to noise ratio, Aluminum, Wave plates, Acoustics, Transmitters, Receivers, Interference (communication), Error analysis

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Proceedings Article | 27 March 2019 Paper

Wave focusing in pipe-like structures via gradient-index metamaterial lens toward damage detection and localization

S. Tol, G. Okudan, D. Ozevin

Proceedings Volume 10970, 109700D (2019) https://doi.org/10.1117/12.2513938

KEYWORDS: Wave propagation, GRIN lenses, Metamaterials, Refractive index, Waveguides, Lens design, Ultrasonics, Signal attenuation, Damage detection, Sensors

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Proceedings Article | 27 March 2018 Presentation + Paper

Piezoelectric micromachined acoustic emission sensors for early stage damage detection in structures

Minoo Kabir, Hanie Kazari, Didem Ozevin

Proceedings Volume 10599, 105990E (2018) https://doi.org/10.1117/12.2303465

KEYWORDS: Sensors, Transducers, Aluminum nitride, Silicon, Microelectromechanical systems, Manufacturing, Acoustic emission, Damage detection

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Proceedings Article | 27 March 2018 Presentation + Paper

Real-time nondestructive monitoring of the gas tungsten arc welding (GTAW) process by combined airborne acoustic emission and non-contact ultrasonics

Lu Zhang, Alexandra-Del-Carmen Basantes-Defaz, Zeynab Abbasi, Donald Yuhas, Didem Ozevin, Ernesto Indacochea

Proceedings Volume 10599, 105991V (2018) https://doi.org/10.1117/12.2297455

KEYWORDS: Sensors, Tungsten, Transducers, Ultrasonics, Nondestructive evaluation, Acoustic emission

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Proceedings Article | 8 May 2017 Presentation + Paper

3D printed metamaterial design to focus wave energy in thin plates

Minoo Kabir, Margaret Allen, Didem Ozevin

Proceedings Volume 10169, 101691I (2017) https://doi.org/10.1117/12.2261348

KEYWORDS: Waveguides, 3D printing, Acoustics, Metamaterials, Signal attenuation, Composites, Sensors, Systems modeling, Wave plates, Acoustic emission, Wave propagation, Aluminum

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Proceedings Article | 19 April 2017 Presentation + Paper

The integration of periodic truss bridge design and impulse response method

Onur Can, Didem Ozevin

Proceedings Volume 10169, 1016916 (2017) https://doi.org/10.1117/12.2261347

KEYWORDS: Receivers, Oscilloscopes, Structural engineering, Failure analysis

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Proceedings Article | 23 September 2016 Presentation + Paper

Integration of periodic structure and highly narrowband MEMS sensor to enhance crack detection ability in steel structures

Minoo Kabir, Didem Ozevin

Proceedings Volume 9918, 99181N (2016) https://doi.org/10.1117/12.2238032

KEYWORDS: Microelectromechanical systems, Sensors, Wave plates, Acoustic emission, Wave propagation, Acoustics, Finite element methods, Crystals, Structural health monitoring, Bridges

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Proceedings Article | 8 April 2016 Presentation + Paper

Fatigue crack growth monitoring of idealized gearbox spline component using acoustic emission

Lu Zhang, Didem Ozevin, William Hardman, Seth Kessler, Alan Timmons

Proceedings Volume 9804, 980409 (2016) https://doi.org/10.1117/12.2220163

KEYWORDS: Acoustic emission, Pattern recognition, Sensors, Signal detection, Ultrasonics, Manufacturing, Data acquisition, Nondestructive evaluation, Ferroelectric materials, Signal processing

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The spline component of gearbox structure is a non-redundant element that requires early detection of flaws for preventing catastrophic failures. The acoustic emission (AE) method is a direct way of detecting active flaws; however, the method suffers from the influence of background noise and location/sensor based pattern recognition method. It is important to identify the source mechanism and adapt it to different test conditions and sensors. In this paper, the fatigue crack growth of a notched and flattened gearbox spline component is monitored using the AE method in a laboratory environment. The test sample has the major details of the spline component on a flattened geometry. The AE data is continuously collected together with strain gauges strategically positions on the structure. The fatigue test characteristics are 4 Hz frequency and 0.1 as the ratio of minimum to maximum loading in tensile regime. It is observed that there are significant amount of continuous emissions released from the notch tip due to the formation of plastic deformation and slow crack growth. The frequency spectra of continuous emissions and burst emissions are compared to understand the difference of sudden crack growth and gradual crack growth. The predicted crack growth rate is compared with the AE data using the cumulative AE events at the notch tip. The source mechanism of sudden crack growth is obtained solving the inverse mathematical problem from output signal to input signal. The spline component of gearbox structure is a non-redundant element that requires early detection of flaws for preventing catastrophic failures. In this paper, the fatigue crack growth of a notched and flattened gearbox spline component is monitored using the AE method The AE data is continuously collected together with strain gauges. There are significant amount of continuous emissions released from the notch tip due to the formation of plastic deformation and slow crack growth. The source mechanism of sudden crack growth is obtained solving the inverse mathematical problem from output signal to input signal.

Proceedings Article | 3 April 2015 Paper

The design, characterization, and comparison of MEMS comb-drive acoustic emission transducers with the principles of area-change and gap-change

Minoo Kabir, Hossain Saboonchi, Didem Ozevin

Proceedings Volume 9435, 94352B (2015) https://doi.org/10.1117/12.2084286

KEYWORDS: Sensors, Microelectromechanical systems, Capacitance, Transducers, Acoustic emission, Wave propagation, Manufacturing, Metals, Surface micromachining, Numerical simulations

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Proceedings Article | 1 April 2015 Paper

Numerical and experimental demonstration of shear stress measurement at thick steel plates using acoustoelasticity

Zeynab Abbasi, Didem Ozevin

Proceedings Volume 9437, 94371M (2015) https://doi.org/10.1117/12.2084275

KEYWORDS: Ultrasonics, Wave plates, 3D modeling, Receivers, Sensors, Transducers, Nondestructive evaluation, Aluminum, Acoustics, 3D metrology

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Proceedings Article | 10 April 2014 Paper

Studying the effect of cracks on the ultrasonic wave propagation in a two dimensional gearbox finite element model

Didem Ozevin, Hossein Fazel, Justin Cox, William Hardman, Seth Kessler, Alan Timmons

Proceedings Volume 9063, 906303 (2014) https://doi.org/10.1117/12.2048519

KEYWORDS: Teeth, Wave propagation, Ultrasonics, Structural health monitoring, Finite element methods, Damage detection, Sensors, Wave plates, 3D modeling, Algorithm development

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Proceedings Article | 9 March 2014 Paper

High frequency elastic wave propagation in large structures using spectral elements and perfectly matched layer

Zahra Heidary, Didem Ozevin

Proceedings Volume 9063, 906309 (2014) https://doi.org/10.1117/12.2044924

KEYWORDS: Wave propagation, Chemical elements, Detection and tracking algorithms, Acoustic emission, Pattern recognition, Sensors, Wave plates, Metals

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Proceedings Article | 8 March 2014 Paper

Numerical and experimental characterizations of piezoresistive MEMS strain sensors

Hossain Saboonchi, Didem Ozevin

Proceedings Volume 9061, 90612G (2014) https://doi.org/10.1117/12.2044922

KEYWORDS: Sensors, Microelectromechanical systems, Silicon, Resistance, Metals, Manufacturing, Aluminum, Acoustic emission, Semiconductors, Micromachining

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Proceedings Article | 19 April 2013 Paper

Numerical and experimental characterizations of low frequency MEMS AE sensors

Hossain Saboonchi, Didem Ozevin

Proceedings Volume 8692, 869211 (2013) https://doi.org/10.1117/12.2009245

KEYWORDS: Sensors, Microelectromechanical systems, Capacitance, Nickel, Manufacturing, Silicon, Aluminum, Metals, Packaging, Signal attenuation

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Proceedings Article | 16 April 2013 Paper

The selection of spectral element polynomial orders for high frequency numerical wave propagation

Zahra Heidary, Didem Ozevin

Proceedings Volume 8694, 86941F (2013) https://doi.org/10.1117/12.2009243

KEYWORDS: Chemical elements, Wave propagation, Finite element methods, Numerical integration, Acoustic emission, Matrices, Ultrasonics, Pollution, Numerical analysis, Nondestructive evaluation

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Proceedings Article | 11 April 2013 Paper

The influence of multi-mode failures in composites on the characteristics of elastic waves

Lu Zhang, Didem Ozevin

Proceedings Volume 8694, 869402 (2013) https://doi.org/10.1117/12.2009244

KEYWORDS: Composites, Acoustic emission, Wave propagation, Finite element methods, Carbon, Pattern recognition, Data modeling, Sensors, Neural networks, Integrated modeling

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Proceedings Article | 5 April 2012 Paper

Multi-physics modeling of sensor-structure interaction for quantitative acoustic emission

Zahra Heidary, Didem Ozevin

Proceedings Volume 8347, 83471U (2012) https://doi.org/10.1117/12.914889

KEYWORDS: Chemical elements, Sensors, Finite element methods, Scanning electron microscopy, Wave propagation, Acoustic emission, Signal detection, 3D modeling, Numerical analysis, Matrices

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Proceedings Article | 3 April 2012 Paper

Numerical demonstration of MEMS strain sensor

Hossain Saboonchi, Didem Ozevin

Proceedings Volume 8345, 83451H (2012) https://doi.org/10.1117/12.914905

KEYWORDS: Sensors, Silicon, Microelectromechanical systems, Metals, Etching, Temperature metrology, Crystals, Manufacturing, Structural health monitoring, Semiconductors

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Proceedings Article | 30 March 2011 Paper

Early state damage detection of aluminum 7075-T6 plate based on acoustic emission

Didem Ozevin, Zhong Li, Zahra Heidary

Proceedings Volume 7983, 798304 (2011) https://doi.org/10.1117/12.879169

KEYWORDS: Sensors, Aluminum, Nondestructive evaluation, Acoustic emission, Damage detection, Data acquisition, Aircraft structures, Finite element methods, Wave plates, Inspection

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Proceedings Article | 1 April 2010 Paper

Steel bridge fatigue crack detection with piezoelectric wafer active sensors

Lingyu Yu, Victor Giurgiutiu, Paul Ziehl, Didem Ozevin, Patrick Pollock

Proceedings Volume 7647, 76471Y (2010) https://doi.org/10.1117/12.847603

KEYWORDS: Sensors, Acoustic emission, Bridges, Active remote sensing, Signal detection, Semiconducting wafers, Transducers, Active sensors, Imaging arrays, Wave plates

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Proceedings Article | 8 April 2009 Paper

Piezoelectric based sensing in wireless steel bridge health monitoring

Lingyu Yu, Victor Giurgiutiu, Paul Ziehl, Didem Ozevin

Proceedings Volume 7294, 72941D (2009) https://doi.org/10.1117/12.830128

KEYWORDS: Bridges, Sensors, Signal detection, Active remote sensing, Sensing systems, Damage detection, Inspection, Acoustic emission, Telecommunications, Semiconducting wafers

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Proceedings Article | 28 April 2008 Paper

Acoustic emission analysis of full-scale honeycomb sandwich composite curved fuselage panels

Frank Leone, Didem Ozevin, Valery Godinez, Bao Mosinyi, John Bakuckas, Jonathan Awerbuch, Alan Lau, Tein-Min Tan

Proceedings Volume 6934, 69340E (2008) https://doi.org/10.1117/12.776146

KEYWORDS: Sensors, Composites, Acoustic emission, Photogrammetry, Signal generators, Nondestructive evaluation, Inspection, Picture Archiving and Communication System, Data acquisition boards, Research facilities

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Proceedings Article | 28 April 2008 Paper

Detecting damage in full-scale honeycomb sandwich composite curved fuselage panels through frequency response

Frank Leone, Didem Ozevin, Bao Mosinyi, John Bakuckas, Jonathan Awerbuch, Alan Lau, Tein-Min Tan

Proceedings Volume 6934, 693405 (2008) https://doi.org/10.1117/12.776166

KEYWORDS: Composites, Sensors, Photogrammetry, Receivers, Acoustics, Failure analysis, Nondestructive evaluation, Inspection, Acoustic emission, Signal attenuation

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Proceedings Article | 19 April 2007 Paper

Integrated acoustic emission/vibration sensor for detecting damage in aircraft drive train components

Valery Godínez-Azcuaga, Didem Ozevin, Richard Finlayson, Athanasios Anastasopoulos, Apostolos Tsimogiannis

Proceedings Volume 6531, 65310C (2007) https://doi.org/10.1117/12.714753

KEYWORDS: Sensors, Acoustic emission, Interference (communication), Data acquisition, Signal processing, Pattern recognition, Signal detection, Acoustics, Nondestructive evaluation, Detection and tracking algorithms

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Diaphragm-type couplings are high misalignment torque and speed transfer components used in aircrafts. Crack development in such couplings, or in the drive train in general, can lead to component failure that can bring down an aircraft. Real time detection of crack formation and growth is important to prevent such catastrophic failures. However, there is no single Nondestructive Monitoring method available that is capable of assessing the early stages of crack growth in such components. While vibration based damage identification techniques are used, they cannot detect cracks until they reach a considerable size, which makes detection of the onset of cracking extremely difficult. Acoustic Emission (AE) can detect and monitor early stage crack growth, however excessive background noise can mask acoustic emissions produced by crack initiation. Fusion of the two mentioned techniques can increase the accuracy of measurement and minimize false alarms. However, a monitoring system combining both techniques could prove too large and heavy for the already restricted space available in aircrafts. In the present work, we will present a newly developed integrated Acoustic Emission/Vibration (AE/VIB) combined sensor which can operate in the temperature range of -55°F to 257°F and in high EMI environment. This robust AE/VIB sensor has a frequency range of 5 Hz-2 kHz for the vibration component and a range of 200-400 kHz for the acoustic emission component. The sensor weight is comparable to accelerometers currently used in flying aircraft. Traditional signal processing approaches are not effective due to high signal attenuation and strong background noise conditions, commonly found in aircraft drive train systems. As an alternative, we will introduce a new Supervised Pattern Recognition (SPR) methodology that allows for simultaneous processing of the signals detected by the AE/VIB sensor and their classification in near-real time, even in these adverse conditions. Finally, we will discuss the architecture developed to produce a fully autonomous monitoring tool based on the fusion of the AE and Vibration techniques.

Proceedings Article | 5 April 2006 Paper

Structural tests using a MEMS acoustic emission sensor

Irving Oppenheim, David Greve, Didem Ozevin, D. Robert Hay, Thomas Hay, Stephen Pessiki, Nathan Tyson

Proceedings Volume 6174, 617404 (2006) https://doi.org/10.1117/12.648676

KEYWORDS: Transducers, Microelectromechanical systems, Acoustic emission, Sensors, Lead, Picture Archiving and Communication System, Computer aided design, Bridges, Signal detection, Electronics

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In a collaborative project at Lehigh and Carnegie Mellon, a MEMS acoustic emission sensor was designed and fabricated as a suite of six resonant-type capacitive transducers in the frequency range between 100 and 500 kHz. Characterization studies showed good comparisons between predicted and experimental electro-mechanical behavior. Acoustic emission events, simulated experimentally in steel ball impact and in pencil lead break tests, were detected and source localization was demonstrated. In this paper we describe the application of the MEMS device in structural testing, both in laboratory and in field applications. We discuss our findings regarding housing and mounting (acoustic coupling) of the MEMS device with its supporting electronics, and we then report the results of structural testing. In all tests, the MEMS transducers were used in parallel with commercial acoustic emission sensors, which thereby serve as a benchmark and permit a direct observation of MEMS device functionality. All tests involved steel structures, with particular interest in propagation of existing cracks or flaws. A series of four laboratory tests were performed on beam specimens fabricated from two segments (Grade 50 steel) with a full penetration weld (E70T-4 electrode material) at midspan. That weld region was notched, an initial fatigue crack was induced, and the specimens were then instrumented with one commercial transducer and with one MEMS device; data was recorded from five individual transducers on the MEMS device. Under a four-point bending test, the beam displayed both inelastic behavior and crack propagation, including load drops associated with crack instability. The MEMS transducers detected all instability events as well as many or most of the acoustic emissions occurring during plasticity and stable crack growth. The MEMS transducers were less sensitive than the commercial transducer, and did not detect as many events, but the normalized cumulative burst count obtained from the MEMS transducers paralleled the count obtained from the commercial transducer. Waveform analysis of signals from the MEMS transducers provided additional information concerning arrivals of P-waves and S-waves. Similarly, the analysis provided additional confirmation that the acoustic emissions emanated from the damage zone near the crack tip, and were not spurious signals or artifacts. Subsequent tests were conducted in a field application where the MEMS transducers were redundant to a group of commercial transducers. The application example is a connection plate in truss bridge construction under passage of heavy traffic loads. The MEMS transducers were found to be functional, but were less sensitive in their present form than existing commercial transducers. We conclude that the transducers are usable in their current configuration and we outline applications for which they are presently suited, and then we discuss alternate MEMS structures that would provide greater sensitivity.

Proceedings Article | 17 May 2005 Paper

Design, characterization, and experimental use of the second generation MEMS acoustic emission device

Didem Ozevin, David Greve, Irving Oppenheim, Stephen Pessiki

Proceedings Volume 5765, (2005) https://doi.org/10.1117/12.601161

KEYWORDS: Transducers, Acoustic emission, Microelectromechanical systems, Picture Archiving and Communication System, Capacitance, Signal detection, Lead, Etching, Atmospheric sensing, Surface micromachining

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We describe the design, fabrication, testing and application (in structural experiments) of our 2004 (second generation) MEMS device, designed for acoustic emission sensing based upon experiments with our 2002 (first generation) device. Both devices feature a suite of resonant-type transducers in the frequency range between 100 kHz and 1 MHz. The 2002 device was designed to operate in an evacuated housing because of high squeeze film damping, as confirmed in our earlier experiments. In additional studies involving the 2002 device, experimental simulation of acoustic emissions in a steel plate, using pencil lead break or ball impact loading, showed that the transducers in the frequency range of 100 kHz-500 kHz presented clearer output signals than the transducers with frequencies higher than 500 kHz. Using the knowledge gained from the 2002 device, we designed and fabricated our second generation device in 2004 using the multi-user polysilicon surface micromachining (MUMPs) process. The 2004 device has 7 independent capacitive type transducers, compared to 18 independent transducers in the 2002 device, including 6 piston type transducers in the frequency range of 100 kHz to 500 kHz and 1 piston type transducer at 1 MHz to capture high frequency information. Piston type transducers developed in our research have two uncoupled modes so that twofold information can be acquired from a single transducer. In addition, the piston shape helps to reduce residual stress effect of surface micromachining process. The center to center distance between etch holes in the vibrating plate was reduced from 30 μm to 13 μm, in order to reduce squeeze film damping. As a result, the Q factor under atmospheric pressure for the 100 kHz transducer was increased to 2.37 from 0.18, and therefore the vacuum housing has been eliminated from the 2004 device. Sensitivities of transducers were also increased, by enlarging transducer area, in order to capture significant small amplitude acoustic emission events. The average individual transducer area in the 2004 device was increased to 6.97 mm² as compared to 2.51 mm² in the 2002 device. In this paper, we report the new experimental results on the characterization of the 2004 device and compare them with analytical results. We show improvements in sensitivity as measured by capacitance and as measured by pencil lead break experiments. Improvement in damping is also evaluated by admittance measurement in atmosphere. Pencil lead break experiments also show that transducers can operate in atmospheric pressure. Finally, we apply the device to acoustic emission experiments on crack propagation in a steel beam specimen, precracked in fatigue, in a four-point bending test.

Proceedings Article | 29 July 2004 Paper

Resonant-type MEMS transducers excited by two acoustic emission simulation techniques

Didem Ozevin, David Greve, Irving Oppenheim, Stephen Pessiki

Proceedings Volume 5391, (2004) https://doi.org/10.1117/12.539538

KEYWORDS: Transducers, Acoustic emission, Microelectromechanical systems, Lead, Time-frequency analysis, Fourier transforms, Signal detection, Surface micromachining, Signal processing, Ceramics

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Proceedings Article | 18 August 2003 Paper

Development of a MEMS device for acoustic emission testing

Didem Ozevin, Stephen Pessiki, Akash Jain, David Greve, Irving Oppenheim

Proceedings Volume 5057, (2003) https://doi.org/10.1117/12.482383

KEYWORDS: Transducers, Microelectromechanical systems, Acoustic emission, Ultrasonics, Sensors, Signal detection, Capacitance, Amplifiers, Receivers, Scanning electron microscopy

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Showing 5 of 38 publications

Proceedings Volume Editor (1)

SPIE Conference Volume | 28 April 2022

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XVI

Conference Committee Involvement (17)

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIX

17 March 2025 | Vancouver, Canada

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XVIII

25 March 2024 | Long Beach, California, United States

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XVII

13 March 2023 | Long Beach, California, United States

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XVI

7 March 2022 | Long Beach, California, United States

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XV

22 March 2021 | Online Only, California, United States

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIV

27 April 2020 | Online Only, California, United States

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII

4 March 2019 | Denver, Colorado, United States

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XII

5 March 2018 | Denver, Colorado, United States

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XI

26 March 2017 | Portland, Oregon, United States

Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, and Civil Infrastructure X

21 March 2016 | Las Vegas, Nevada, United States

Structural Health Monitoring and Inspection of Advanced Materials, Aerospace, and Civil Infrastructure IX

9 March 2015 | San Diego, California, United States

Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security VIII

10 March 2014 | San Diego, California, United States

Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security VI

12 March 2012 | San Diego, California, United States

Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security V

7 March 2011 | San Diego, California, United States

Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security IV

8 March 2010 | San Diego, California, United States

Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security III

9 March 2009 | San Diego, California, United States

Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security II

11 March 2008 | San Diego, California, United States

Showing 5 of 17 Conference Committees

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