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Hyoung-Sub Shim
at Korea Institute of Industrial Technology
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Publications (1)
Proceedings Article | 5 December 2005 Paper
Design and parameter optimization of flip-chip bonder
Hyoungsub Shim, Heuiseok Kang, Hoon Jeong, Youngjune Cho, Wansoo Kim, Shinill Kang
Proceedings Volume 6048, 60480G (2005) https://doi.org/10.1117/12.648757
KEYWORDS: Head, Scanning electron microscopy, Semiconducting wafers, Wafer bonding, Manufacturing, Temperature metrology, Packaging, Optics manufacturing, Information technology, Manufacturing equipment
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