Computers, mobile phones, cameras and video equipment and other electronic products, Moving in the light, thin,
small, high speed, high reliability, multi-functional aspects of development, Namely, 3G technology and the SOC
of. Therefore, the various components of the packaging technology have become increasingly demanding,
Electronic components of residual stress after encapsulation and the use of temperature changes during, Body will
be made electronic packaging warpage, Seriously affect the quality of the product. Therefore, to establish a set of
micron, sub-micron-level detection method for testing. In this paper, Moiré fringe method to measure warpage of
electronic packages body volume, Was first proposed application of Rayleigh-Sommerfeld diffraction theory, Proof
presented in this paper with a small spacing diffraction grating problems arising from the assumption can be
overcome, Greatly improved the precision deformation measurement of electronic components.
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