Proc. SPIE. 10284, Optoelectronic Interconnects and Packaging, 102840N. (July 07, 2017) doi: 10.1117/12.229274
Proc. SPIE. 6880, Laser-based Micro- and Nanopackaging and Assembly II, 68800G. (February 07, 2008) doi: 10.1117/12.763105
Proc. SPIE. 6478, Photonics Packaging, Integration, and Interconnects VII, 64780H. (February 08, 2007) doi: 10.1117/12.714298
Proc. SPIE. 6478, Photonics Packaging, Integration, and Interconnects VII, 647809. (February 08, 2007) doi: 10.1117/12.709761
Proc. SPIE. 6478, Photonics Packaging, Integration, and Interconnects VII, 647803. (February 08, 2007) doi: 10.1117/12.705591
Proc. SPIE. 6019, Passive Components and Fiber-based Devices II, 601938. (November 24, 2005) doi: 10.1117/12.635519
Proc. SPIE. 5595, Active and Passive Optical Components for WDM Communications IV, 428. (October 25, 2004) doi: 10.1117/12.569270
Proc. SPIE. 5602, Optomechatronic Sensors, Actuators, and Control, 107. (September 29, 2004) doi: 10.1117/12.571211
Proc. SPIE. 5264, Optomechatronic Systems IV, 283. (October 02, 2003) doi: 10.1117/12.519164
Proc. SPIE. 4805, Design and Fabrication of Planar Optical Waveguide Devices and Materials, 125. (November 01, 2002) doi: 10.1117/12.473744
Proc. SPIE. 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, 223. (April 27, 2000) doi: 10.1117/12.384400
Proc. SPIE. 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV, 128. (April 14, 1999) doi: 10.1117/12.345423
Proc. SPIE. 3184, Microelectronic Packaging and Laser Processing, 95. (August 18, 1997) doi: 10.1117/12.280559
Proc. SPIE. 3005, Optoelectronic Interconnects and Packaging IV, 202. (April 04, 1997) doi: 10.1117/12.271088
Proc. SPIE. 2691, Optoelectronic Packaging, 124. (March 29, 1996) doi: 10.1117/12.236914
Proc. SPIE. 2524, National Science Foundation (NSF) Forum on Optical Science and Engineering, 164. (September 15, 1995) doi: 10.1117/12.219570
Proc. SPIE. 2400, Optoelectronic Interconnects III, 61. (April 05, 1995) doi: 10.1117/12.206334
Proc. SPIE. 2400, Optoelectronic Interconnects III, 80. (April 05, 1995) doi: 10.1117/12.206296
Proc. SPIE. 1573, Commercial Applications of Precision Manufacturing at the Sub-Micron Level, 98. (April 01, 1992) doi: 10.1117/12.57748
Proc. SPIE. 10085, Components and Packaging for Laser Systems III, 100850C. (February 27, 2017) doi: 10.1117/12.2255556
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