Die Board Cutting by CO[sub]2[/sub] Laser

Neil Forbes

doi:10.1117/12.959373

31 October 1980 Die Board Cutting by CO₂ Laser

Neil Forbes

Proceedings Volume 0247, Advances in Laser Engineering and Applications; (1980) https://doi.org/10.1117/12.959373
Event: 24th Annual Technical Symposium, 1980, San Diego, United States

Abstract

The conventional method of dieboard manufacture is described and compared with the laser dieboard process. Consideration is given to savings achievable as a result of the precision die produced by laser cutting in combination with numerical control. The development of machines is briefly discussed and modern laser die-board cutters are described. Some points on laser job shops are also covered.

Citation Download Citation

Neil Forbes "Die Board Cutting by CO₂ Laser", Proc. SPIE 0247, Advances in Laser Engineering and Applications, (31 October 1980); https://doi.org/10.1117/12.959373

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