Paper
30 June 1982 High Throughput Testing
A. H. Marshall, R. K. Buchness, D. F. Schmunk, L. F. Vasel
Author Affiliations +
Abstract
Several IFPA programs having large quantities of deliverable devices provided Rockwell with the necessity of solving the many problems associated with high volume production. The facility contains processing, assembly, and cryogenic testing equipment.
© (1982) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
A. H. Marshall, R. K. Buchness, D. F. Schmunk, and L. F. Vasel "High Throughput Testing", Proc. SPIE 0311, Mosaic Focal Plane Methodologies II, (30 June 1982); https://doi.org/10.1117/12.932810
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KEYWORDS
Cryogenics

Sensors

Data conversion

Charge-coupled devices

Semiconducting wafers

Control systems design

Computing systems

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