Laser-assisted manufacturing of super-insulation materials

Zhen Wang; Tao Zhang; Byung Kyu Park; Woo Il Lee; David Hwang

doi:10.1117/12.2251270

20 February 2017 Laser-assisted manufacturing of super-insulation materials

Zhen Wang, Tao Zhang, Byung Kyu Park, Woo Il Lee, David Hwang

Proceedings Volume 10091, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXII; 100910B (2017) https://doi.org/10.1117/12.2251270
Event: SPIE LASE, 2017, San Francisco, California, United States

Abstract

Being lightweight materials with good mechanical and thermal properties, hollow glass micro-particles (HGMPs) have been widely studied for multiple applications. In this study, it is shown that by using reduced binder fraction diluted in solvent, enables minimal contacts among the HGMPs assisted by a natural capillary trend, as confirmed by optical and electron microscope imaging. Such material architecture fabricated in a composite level proves to have enhanced thermal insulation performance through quantitative thermal conductivity measurement. Mechanical strength has also been evaluated in terms of particle-binder bonding by tensile test via in-situ microscope inspection. Effect of laser treatment was examined for further improvement of thermal and mechanical properties by selective binder removal and efficient redistribution of remaining binder components.

The fabricated composite materials have potential applications to building insulation materials for their scalable manufacturing nature, improved thermal insulation performance and reasonable mechanical strength. Further studies are needed to understand mechanical and thermal properties of the resulting composites, and key fabrication mechanisms involved with laser treatment of complex multi-component and multi-phase systems.

Citation Download Citation

Zhen Wang, Tao Zhang, Byung Kyu Park, Woo Il Lee, and David Hwang "Laser-assisted manufacturing of super-insulation materials", Proc. SPIE 10091, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXII, 100910B (20 February 2017); https://doi.org/10.1117/12.2251270

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