New multiwire Fixed Abrasive Slicing Technology (FAST)

Frederick Schmid

doi:10.1117/12.2284005

19 May 2003 New multiwire Fixed Abrasive Slicing Technology (FAST)

Frederick Schmid

Proceedings Volume 10314, Optifab 2003: Technical Digest; 103140G (2003) https://doi.org/10.1117/12.2284005
Event: OptiFab 2003, 2003, Rochester, NY, United States

Abstract

A new multiwire Fixed Abrasive Slicing Technology (FAST) was developed that combines the low kerf loss and high material utilization of multiwire slicing (MWS), low consumable costs of internal diameter (ID) slicing and low cost of multiblade slicing (MBS) technologies. Recent improvements in FAST allow it to be utilized for effective slicing of hard materials at low cost. For over two years, 2-inch diameter sapphire has been sliced in prototype mode for supplying wafers to the industry.

Citation Download Citation

Frederick Schmid "New multiwire Fixed Abrasive Slicing Technology (FAST)", Proc. SPIE 10314, Optifab 2003: Technical Digest, 103140G (19 May 2003); https://doi.org/10.1117/12.2284005

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