Paper
30 January 1989 Image Reversal Resist for g-line Exposure: Chemistry and Lithographic Evaluation
Gerhard Buhr, Helmut Lenz, Siegfried Scheler
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Abstract
Fundamentals and mechanism of a direct image reversal process, which switches the tone of a resist from positive to negative without added bases are presented. A sulfonic acid generated photochemically from an aryl naphthoquinonediazide-sulfonate catalyzes the crosslinking of exposed resist areas. Based on this principle, a concept for a new naphthoquinonediazide with sufficient absorptivity at g-line and preserved acid generating capability was developed. The desired functionality of the PAC, prepared in a multistep synthesis, is proven. Guidelines for optimization of the most important process parameters are established for the newly formulated g-line image reversal resist. Lithographic results include 0.6 μm equal lines and spaces with nearly vertical side walls using a 0.35 NA g-line stepper.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gerhard Buhr, Helmut Lenz, and Siegfried Scheler "Image Reversal Resist for g-line Exposure: Chemistry and Lithographic Evaluation", Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); https://doi.org/10.1117/12.953024
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CITATIONS
Cited by 9 scholarly publications and 2 patents.
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KEYWORDS
Image processing

Photoresist processing

Picture Archiving and Communication System

Lithography

Photolysis

Floods

Semiconducting wafers

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