Electrical Defect Monitoring For Process Control

Charles F. King; G. Peter Gill; Michael J. Satterfield

doi:10.1117/12.953082

19 July 1989 Electrical Defect Monitoring For Process Control

Charles F. King, G. Peter Gill, Michael J. Satterfield

Proceedings Volume 1087, Integrated Circuit Metrology, Inspection, and Process Control III; (1989) https://doi.org/10.1117/12.953082
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

The use of electrical defect monitoring for process control is described. Details are presented of the use of fast cycle time short flow snake lots for metal and poly processes in an advanced CMOS pilot production line. Contributions to defectivity from diffusion, CVD, and etch processes are described briefly. The nature and origin of three different types of photo process defects are discussed together with methods of eliminating these defects; a track develop system gave lower defect density than a batch develop system, and a higher numerical aperture stepper led to the reduction of a micro bridging defect mechanism. An application of snake processing to give improvements in a contrast enhancement layer photo technique showed that contrast enhancement layer strip time was a key factor in improving yields. The need for an integrated photo monitoring system consists of snake patterns and other forms of inspection is discussed.

Citation Download Citation

Charles F. King, G. Peter Gill, and Michael J. Satterfield "Electrical Defect Monitoring For Process Control", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); https://doi.org/10.1117/12.953082

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