Open Access Paper
24 May 2019 Front Matter: Volume 10906
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 10906, including the Title Page, Copyright information, Table of Contents, and Conference Committee listing.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

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Author(s), “Title of Paper,” in Laser-based Micro- and Nanoprocessing XIII, edited by Udo Klotzbach, Akira Watanabe, Rainer Kling, Proceedings of SPIE Vol. 10906 (SPIE, Bellingham, WA, 2019) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510624542

ISBN: 9781510624559 (electronic)

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Paper Numbering: Proceedings of SPIE follow an e-First publication model. A unique citation identifier (CID) number is assigned to each article at the time of publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online and print versions of the publication. SPIE uses a seven-digit CID article numbering system structured as follows:

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  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Authors

Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc.

Aguilar-Morales, A., 0S

Alamri, S., 0S

Alexander, Dennis R., 0N, 0Q

Ancona, Antonio, 0E, 0O

Anderson, Mark, 0N, 0Q

Aoyagi, Eiji, 12

Arakawa, Masaki, 09

Atkins, Robert, 0A

Badiee, Amir, 07

Bae, Jongsuck, 1L

Basso, E. T., 1I

Bessho, Motoki, 1L

Bhaskar, Arun, 0K

Bieda, M., 0S

Bolsinger, Marius, 1D

Bourdenet, R., 1P

Braud, Flavie, 0K

Buencuerpo, J., 1H

Butkus, Simas, 0H

Cai, Jinguang, 12

Casquero, N., 1H

Chai, Yingjie, 1R

Champion, A., 0F

Cheng, He, 1R

Chicanne, C., 1P

Cinquino, Marco, 0O

Costa, Carolina, 11

Décultot, M., 0F

Di Franco, Cinzia, 0O

Di Mundo, Rosa, 0O

Dogan, Y., 0A

Du, Xinpeng, 1R

Dubois, Emmanuel, 0K

Ediger, Aaron, 0Q

Ehrenmann, Steffen, 04

Ehrhardt, M., 0T

Enderle, Sebastian, 1D

Faber, Max, 1G

Faucon, M., 1B

Flamm, Daniel, 16, 1G

Fuchs, U., 14

Fujimoto, Junichi, 09

Gaquiere, Christophe, 0K

Gaudiuso, Caterina, 0O

Gebauer, Jana, 0C

Geoffray, I., 1P

Ghosh, Priyanka, 07

Giannuzzi, Giuseppe, 0O

Gloria, Daniel, 0K

Gogos, George, 0Q

Goto, Tetsuya, 0J

Götze, Marco, 11

Gräf, S., 14

Grossmann, Daniel, 16, 1G

Hamam, H., 1I

Heilmann, Andreas, 11

Heimes, Andreas, 0G

Henrottin, A., 0F

Hillrichs, Georg, 11

Horita, Naoki, 1L

Hu, C., 0A

Hu, Juejun, 0X

Huneus, Florian, 0G

Ikenoue, Hiroshi, 0J

Imokawa, Kaname, 0J

Ito, Shun, 12

Janami, Kian, 0G

Jebali, M. A., 1I

Jenne, Michael, 16, 1G

Kaiser, M., 16

Kang, Myungkoo, 0X

Kar, Aravinda, 1R

Kawasuji, Yasufumi, 09

Kiedrowski, Thomas, 15

Kleiner, Jonas, 16, 1G

Kling, R., 1B

Klotzbach, Udo, 0C, 0S

Knoblauch, Volker, 1D

Kobayashi, Masakazu, 09

Kracht, C., 0S

Krupop, B., 0S

Kruse, Corey, 0Q

Kumkar, Malte, 16, 1G

Kunze, T., 0S

Kürbitz, Tobias, 11

Lang, V., 0S

Lasagni, Andrés Fabían, 0C, 0S, 0W, 15

Le Goaec, B., 1B

Lingel, Christian, 0G

Lorenz, P., 0T

Lugarà, Pietro Mario, 0O

Madsen, C. K., 0A

Malendevych, Teodor, 0X

Martínez-Calderón, M., 1H

Merle, M., 1P

Mezera, M., 0U

Mikhaylov, Dmitriy, 15

Mincuzzi, G., 1B

Mingareev, Ilya, 0X

Mirenghi, Luciana, 0O

Mizoguchi, Hakaru, 09

Mizutani, Akira, 09

Möhl, A., 14

Morrison, M., 0A

Müller, F. A., 14

Nagayama, Norio, 1N

Nakamura, Daisuke, 0J

Neugebauer, Christoph, 04

Nishio, Takuei, 1N

Nolte, Stefan, 16, 1G

Nourry, S., 1B

Ogawa, Sayaka, 12

Okada, Etienne, 0K

Olaizola, S. M., 1H

Ono, Shingo, 1L

Onose, Takashi, 09

Osellame, Roberto, 0E

Pacella, Manuela, 07

Pagano, P., 1B

Paiè, Petra, 0E

Paipulas, Domas, 0H

Patars, J., 0F

Peng, Edwin, 0N, 0Q

Pérez, N., 1H

Philippe, Justine, 0K

Quaranta, Salay, 04

Rahaman, Arifur, 1R

Ramos-de-Campos, J. A., 0F

Rank, A., 0W

Rebière, A., 1B

Rest, Christian, 04

Richardson, Kathleen, 0X

Richardson, Martin, 0X

Riegel, Harald, 1D

Robillard, Jean-François, 0K

Rodríguez, A., 1H

Römer, G.R.B.E., 0U

Roth, Nick, 0Q

Ruck, Simon, 1D

Sadoh, Taizoh, 0J

Sadowitz, Jon, 04

San-Blas, A., 1H

Sánchez-Brea, L., 1H

Scamarcio, Gaetano, 0O

Schell, F., 0S

Schmelzer, Christian E. H., 11

Shield, Jeffrey, 0N, 0Q

Shimbori, Masashi, 09

Sirutkaitis, Valdas, 0H

Soileau, M.J., 1R

Steege, T., 0S

Storm, S., 0S

Sudo, Masaaki, 1L

Suhara, Hiroyuki, 1N

Suwa, Akira, 09, 0J

Tamura, Asato, 1N

Tanaka, Nozomu, 0J

Tao, Sha, 1A

Teutoburg-Weiss, S., 0W

Theobald, M., 1P

Thomas, William, 0N

Tillkorn, Christoph, 0G

Tsubaki, Alfred, 0N, 0Q

Voisiat, B., 0S, 0W

Volpe, Annalisa, 0E

Wang, Brian, 1A

Watanabe, Akira, 12

Weller, Manuel, 1D

Wickenhagen, S., 14

Yin, Gufan, 0X

Yu, Xi, 1L

Yu, Xiaoming, 1R

Zagoranskiy, I., 0T

Zeller, Thomas, 0G

Zhang, Jie, 1A

Zhao, Jay, 1A

Zhou, Boyang, 1R

Zimmer, K., 0T

Zimmermann, Felix, 16, 1G

Zuhlke, Craig A., 0N, 0Q

Zwahr, C., 0S

Conference Committee

Symposium Chairs

  • Beat Neuenschwander, Berner Fachhochschule Technik und Informatik (Switzerland)

  • Xianfan Xu, Purdue University (United States)

Symposium Co-chairs

  • Koji Sugioka, RIKEN Center for Advanced Photonics (Japan)

  • Reinhart Poprawe, Fraunhofer-Institut für Lasertechnik (Germany)

Program Track Chairs

  • Henry Helvajian, The Aerospace Corporation (United States)

  • Guido Hennig, Daetwyler Graphics AG (Switzerland)

Conference Chair

  • Udo Klotzbach, Fraunhofer IWS Dresden (Germany)

Conference Co-chairs

  • Akira Watanabe, Tohoku University (Japan)

  • Rainer Kling, ALPhANOV (France)

Conference Program Committee

  • Antonio Ancona, CNR-Istituto di Fotonica e Nanotecnologie (Italy)

  • Arkadiusz J. Antończak, Wroclaw University of Science and Technology (Poland)

  • Ya Cheng, Shanghai Institute of Optics and Fine Mechanics (China)

  • Jiyeon Choi, University of Science and Technology (Korea, Republic of) and Korea Institute of Machinery & Materials (Korea, Republic of)

  • Francois Courvoisier, Université de Franche-Comté (France)

  • Chunlei Guo, University of Rochester (United States)

  • Miguel Holgado Bolaños, Universidad Politécnica de Madrid (Spain)

  • Minghui Hong, National University of Singapore (Singapore)

  • Andrés-Fabián Lasagni, Technische Universität Dresden (Germany)

  • Yongfeng Lu, University of Nebraska-Lincoln (United States)

  • Yoshiki Nakata, Osaka University (Japan)

  • Wilhelm Pfleging, Karlsruhe Institut für Technologie (Germany)

  • Ulf Quentin, TRUMPF Laser- und Systemtechnik GmbH (Germany)

  • Barbara Stadlober, JOANNEUM RESEARCH Forschungsgesellschaft mbH (Austria)

  • Razvan Stoian, Laboratoire Hubert Curien (France)

  • Koji Sugioka, RIKEN (Japan)

  • Hong-Bo Sun, Tsinghua University (China)

  • Jorma Vihinen, Tampere University of Technology (Finland)

  • Kunihiko Washio, Paradigm Laser Research Ltd. (Japan)

  • Michael J. Withford, Macquarie University (Australia)

  • Xianfan Xu, Purdue University (United States)

  • Haibin Zhang, ESI, Inc. (United States)

  • Haiyan Zhao, Tsinghua University (China)

Session Chairs

  • 1 Laser Micro Structuring and Processing I

    Udo Klotzbach, Fraunhofer IWS Dresden (Germany)

  • 2 Laser Micro Structuring and Processing II

    Akira Watanabe, Tohoku University (Japan)

  • 3 Laser Micro/Nano Processing on Flexible Substrate

    Rainer Kling, ALPhANOV (France)

  • 4 Laser Micro/Nano Processing on Semiconductor

    Kunihiko Washio, Paradigm Laser Research Ltd. (Japan)

  • 5 Laser Micro/Nanostructuring on Metal

    Geoffrey Lott, ESI, Inc. (United States)

  • 6 Large Area Micro/Nanostructuring Laser Interference Patterning

    Arkadiusz J. Antończak, Wroclaw University of Science and Technology (Poland)

  • 7 Direct Write Processing Ablation and Surface Modification

    Jiyeon Choi, University of Science and Technology (Korea, Republic of) and Korea Institute of Machinery & Materials (Korea, Republic of)

  • 8 Laser Nano Structuring and Processing

    Antonio Ancona, CNR-Istituto di Fotonica e Nanotecnologie (Italy)

  • 9 Beam Shaping and Propagation for Laser Micro/Nano Processing

    Wilhelm Pfleging, Karlsruher Institut für Technologie (Germany)

  • 10 High Speed Laser Beam Engineering Systems

    Yongfeng Lu, University of Nebraska-Lincoln (United States)

  • 11 Advanced 1D to 3D Subtractive and Additive Process

    Ya Cheng, Shanghai Institute of Optics and Fine Mechanics (China)

Introduction

The Laser-based Micro- and Nanoprocessing conference brings together researchers and engineers from scientific and academic institutions and industry in order to provide a platform for mutual and fruitful discussion on application-oriented, cutting-edge research fields. The scope of relevant applications covers the fabrication of electronic, photonic, mechanical, chemical, bio-active, and bio-compatible devices. Because of the strong economic demands, laser materials processing is playing increasingly important roles in areas covered by the LBMP conference.

Advanced laser-based processes for micro- and nano-processing are strongly demanded by high-tech industries for specialized prototypes and high throughput devices with micro- and nanostructures to realize electronic, photonics, mechanical, fluidic, chemical, and biological functionalities. However, the realization of such prototypes and devices for industrial manufacturing imposes new challenges for laser sources and beam propagation and beam modifications.

The laser-induced modification of material properties at micro- or nano scales becomes more and more important in industrial applications where undesired material and surface modification such as chemical or heat-affected structural change must be avoided. Decrease the production costs or significant changes of established production lines are the challenges for the future industrial implementation. Therefore, both high-performance new products and innovations for high efficiency/high-throughput manufacturing and assembly technologies are the focus of the conference.

The conference LBMP XIII was held on 5-7 February as a part of LASE 2019 at Photonics West in San Francisco, California. LBMP-XIII comprised around 60 presentations and posters which were presented by speakers from Belgium, China, France, Germany, Italy, Japan, Netherland, Lithuania, Singapore, Spain, Turkey, UK, and USA. Presentations represented a wide number of topics including: laser micro- and nano processing, ultrashort pulsed laser processing, direct-write processing and surface-modification, beam modification and additive manufacturing.

Laser-based micro- and Nano processing were highlighted in sessions with micro- and nano- processing of several kinds of materials and high speed laser beam engineering systems talks. All sessions included topics very interesting for many scientific communities at universities and research institutes. At the same time, many industrial applications have a background of micro- and nano processing or optical background.

We would like to express our deepest gratitude to the program committee members and the SPIE technical staff for their great efforts during the planning and organization of LBMP-XIII We would also like to thank the invited speakers and presenters of the contributed papers for their contribution to the success of this conference. All the manuscripts were reviewed to ensure the quality of the conference proceedings.

Udo Klotzbach

Akira Watanabe

Rainer Kling

© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 10906", Proc. SPIE 10906, Laser-based Micro- and Nanoprocessing XIII, 1090601 (24 May 2019); https://doi.org/10.1117/12.2531405
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KEYWORDS
Laser processing

Semiconductor lasers

Laser applications

Laser marking

Excimer lasers

Carbon dioxide lasers

Laser cutting

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