Predicting stochastic defects across the process window

Andreas Frommhold; Dorin Cerbu; Joost Bekaert; Lieve Van Look; Mark Maslow; Gijsbert Rispens; Eric Hendrickx

doi:10.1117/12.2536898

29 November 2019 Predicting stochastic defects across the process window

Andreas Frommhold, Dorin Cerbu, Joost Bekaert, Lieve Van Look, Mark Maslow, Gijsbert Rispens, Eric Hendrickx

Author Affiliations +

Proceedings Volume 11147, International Conference on Extreme Ultraviolet Lithography 2019; 1114708 (2019) https://doi.org/10.1117/12.2536898
Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

Abstract

A method is proposed for fast CDSEM screening of defect process windows. The concept of Tail CD is used to build defect correlation trends from limited sampling. The trends are extrapolated towards larger ensembles to overcome the throughput limitation of the CDSEM. Application of the methodology on 3 different use cases (square and hexagonal contact hole arrays and L/S pattern) was demonstrated and limitations discussed. The impact of experimental conditions such as illumination, resist choice and etch was investigated. The predicted process windows were verified for selected dies to check the accuracy of the prediction, which showed good agreement.

Conference Presentation

Citation Download Citation

Andreas Frommhold, Dorin Cerbu, Joost Bekaert, Lieve Van Look, Mark Maslow, Gijsbert Rispens, and Eric Hendrickx "Predicting stochastic defects across the process window", Proc. SPIE 11147, International Conference on Extreme Ultraviolet Lithography 2019, 1114708 (29 November 2019); https://doi.org/10.1117/12.2536898

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